Résultats exploitables
Direct Module Attach (DMA) is a method of mounting multichip module (MCM)-D onto circuit boards without the need to use an additional packaging technology (eg ball grid array, BGA). An MCM-D module is equipped with large diameter solder balls which form the bond between the MCM-D and the circuit board in the same manner as in a flip chip IC or BGA package. MCM-D using DMA mounting is particularly targeted at components for the wireless communications markets where good performance at microwave frequencies and miniaturization of radio frequency (RF) functions is required. The mechanical reliability of the technique under thermal cycling has been proven and excellent low parasitic RF characteristics demonstrated. Applications manufactured to demonstrate the technique include a 2.45 GHz voltage controlled oscillator for use in a Wireless local area network (LAN) radio system and a 5.2 GHz RF front end suitable for use in the HIPERLAN or U-NII frequency bands. Users of this technique can expect to realise reliable, high performing, and highly integrated RF functions at an absolute minimum size.
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