Obiettivo
The project aims at achieving the improvement of Photonic Integrated Circuit (PIC) building blocks (BBs) for generic integration technology, the design and fabrication of high bit-rate transmitter PICs, typically WDM 10x 25Gbps and 4x 25GBau Tx PIC as test vehicles for the deve-loped BBs, and finally the test and validation of the fabricated PICs in a transmission environment. The program addresses a significant step beyond the present state-of-the-art.
To achieve these goals, both partners have adequate infrastructure and complementary means. Some challenging milestones will be set to be reached, such as deep UV stepper lithography; assessment of semi-insulating (SI)-substrate based technology; SAG (Selective Area Growth) epitaxy techniques; SiBH (Semi-Insulating Buried Hetero-structure); advanced RF (radio-frequency) circuit engineering. The test vehicles will be validated in transmission systems, and potential markets for the developed PICs will be explored.
Campo scientifico
Invito a presentare proposte
FP7-PEOPLE-2012-ITN
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Meccanismo di finanziamento
MC-ITN - Networks for Initial Training (ITN)Coordinatore
91767 Palaiseau Cedex
Francia