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Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors

Project description

Embedded memory technologies for smart mobility

Embedded non-volatile memory (NVMe) and phase change memory (PCM) are emerging technologies with significant potential for smart mobility and smart society applications. The EU-funded WAKeMeUP project aims to create high-value semiconductor circuits in Europe using a groundbreaking technology. This will be achieved by establishing a pilot line for advanced microcontrollers with embedded NVMe, focusing on the design and manufacturing of innovative applications for the smart mobility and smart society domains. Additionally, the project aims to industrialise embedded PCM technology, using the FDSOI 28nm logic process pilot line. WAKeMeUP will explore alternative memory solutions and make advancements in materials, device physics, architectures and design to minimise energy consumption. The ultimate goal is to bring this technology to an early industrial maturity stage.

Objective

The WAKEMEUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains.
The already defined microcontrollers with 40nm embedded flash technology will be consolidated to build a solid manufacturing platform. Additional developments will be performed for the integration of memory, power management, connectivity, hard security on the same chip.
The project will also target the industrialization of the embedded Phase Change Memory (PCM) technology built on top of the FDSOI 28nm logic process pilot line. The development of the ePCM will be driven by the final application requirements as well as decreasing the power consumption.
The alternative memory solutions will be also studied as they have different - and complementary - traits in such areas as read/write speed, power and energy consumption, retention and endurance, and device density and benchmarked with the ePCM and the conventional eFlash. Continued advances in materials, device physics, architectures and design could further reduce the energy consumption of these memories.
To achieve this goal of generating high value added semiconductor circuits in Europe in a breakthrough leading edge technology the project will deploy all the necessary activities to bring a new technology to an early industrial maturity stage. These activities encompass such developments as: technology enhancements for various specific application requirements such as wide temperature range and reliability, high security requests, high flexibility…, design enablment allowing first time silicon success, prototyping demonstrator products in the different application areas.
In the WAKEMEUP project, new devices and systems will be developed by the application partners in automotive and secure based on FD-SOI and embedded digital technology to answer specific applications needs.

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Programme(s)

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Topic(s)

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Funding Scheme

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IA - Innovation action

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-ECSEL-2017-1-IA-two-stage

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Coordinator

STMICROELECTRONICS CROLLES 2 SAS
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 8 308 998,61
Address
RUE JEAN MONNET 850
38920 CROLLES
France

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Region
Auvergne-Rhône-Alpes Rhône-Alpes Isère
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 41 544 993,05

Participants (19)

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