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Fabricating Functional Components in Room Temperature

Project description

Room-temperature manufacturing of multi-material components including ceramics

Manufacturing integrated components can face challenges when it comes to the compatibility of manufacturing processes for the various subcomponents. Temperature compatibility is a critical parameter. The processing of electroceramics, integral to many applications, requires extremely high temperatures. Not only does this pose a barrier to contact and integration with subcomponents including polymeric ones, but it also requires tremendous amounts of energy. The EU-funded FUNCOMP project will build on its ceramics densification process at room temperature and post-processing at very low temperature for successful multi-material system integration. The team plans to evaluate its room-temperature fabrication methods in the production of accelerometer and antenna components.

Objective

Electroceramics are key materials in all electronics. These ceramic components are used for example in sensing of force, acceleration, and humidity, in energy harvesting, and in frequency tuning of antennas and filters. They are also used for miniaturization and packaging of electronics systems and devices. The main disadvantage of electroceramics is that the fabrication requires relatively high investments and it consumes significant amount of energy due to high sintering temperatures (850-2000 oC). This also makes limitations in contacting and an integration with other materials. However, in the last few years realization of electroceramic components with room temperature fabrication (RTF) has become possible. Our ERC project “Printed Electroceramics with Ultimate Compositions” led to extremely interesting discoveries and opens up a totally new horizons to fabricate functional composites at room temperature. The new finding to use densification process of ceramics at room temperature and post-processing at very low (120 °C) temperature opened a utilization pathway for successful multimaterial system integration.We demonstrated that RTF is feasible for realization e.g. dielectrics based on Li2MoO4 ceramics and its composites while new endeavors in integration will be done in this proposed PoC project. Three main application areas, namely wireless 5G, IoT and automotive are all eagerly looking for new approaches for integration, packaging and sensing. In this Proof-of-Concept we will focus on utilization steps to evaluate RTF composite technology in e.g. accelerometer and antenna components so that the first industrially applicable prototypes and samples can be manufactured and demonstrated.

Host institution

OULUN YLIOPISTO
Net EU contribution
€ 150 000,00
Address
PENTTI KAITERAN KATU 1
90014 Oulu
Finland

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Region
Manner-Suomi Pohjois- ja Itä-Suomi Pohjois-Pohjanmaa
Activity type
Higher or Secondary Education Establishments
Links
Total cost
€ 150 000,00

Beneficiaries (1)