Nanomechanical Switch-Based Logic and Non-Volatile Memory for Robust Ultra-Low Power Circuits

Project Information

ZeroAMP

Grant agreement ID: 871740

DOI 10.3030/871740

EC signature date 5 December 2019

Start date 1 January 2020

End date 30 June 2024

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Total cost € 3 481 243,75

EU contribution € 3 481 243,75

Coordinated by

MICROCHIP TECHNOLOGY CALDICOT LIMITED
United Kingdom

Deliverables

Websites, patent fillings, videos etc. (3)

Interim workshop.

Interim workshop Summary of the feedback on concepts and preliminary results received at this interim workshop

Website.

Website. Public project website serving as a dissemination gateway. A first version will be published at the latest in M03, a comprehensive version in M06

Flyer, introductory video and press kit.

Flyer, introductory video and press kit. Summary description of the TiGRE flyer, intro video and ready-made press kits.

Publications

Conference proceedings (2)

Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding

Author(s): Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Yuji Takabayashi, A., Sattari, H., Quack, N., Jezzini, M., Su Lee, J., Kumar Malik, A., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K. B. & Niklaus, F
Published in: WaferBond’22 Conference, 2022
Publisher: WaferBond’22 Conference

Wafer-level vacuum sealing for packaging of silicon photonic MEMS

Author(s): Gaehun Jo, Pierre Edinger, Simon Bleiker, Xiaojing Wang, Alain Y. Takabayashi, Hamed Sattari, Niels Quack, Moises A. Jezzini de Anda, Peter Verheyen, Göran Stemme, Wim Bogaerts, Kristinn B. Gylfason, Frank Niklaus
Published in: Silicon Photonics XVI, 2021, Page(s) 11, ISBN 9781510642188
Publisher: SPIE
DOI: 10.1117/12.2582975

Peer reviewed articles (4)

AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction

Author(s): Ku, B., van de Wetering, F., Bolten, J., Stel, B., van de Kerkhof, M. A. & Lemme, M. C.
Published in: Advanced Materials Technologies, 2022, ISSN 2365-709X
Publisher: Wiley
DOI: 10.1002/admt.202200411

Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic

Author(s): Reynolds, J. D., Rana, S., Worsey, E., Tang, Q., Kulsreshath, M. K., Chong, H. M. H. & Pamunuwa, D.
Published in: Advanced Electronic Materials, 2022, ISSN 2199-160X
Publisher: Wiley
DOI: 10.1002/aelm.202200584

Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory

Author(s): Dinesh Pamunuwa, Elliott Worsey, Jamie D Reynolds, Derek Seward, Harold M H Chong, Sunil Rana
Published in: IEEE Journal of Microelectromechanical Systems, 2022, ISSN 1941-0158
Publisher: IEEE
DOI: 10.1109/jmems.2021.3138022

Wafer-level hermetically sealed silicon photonic MEMS

Author(s): Gaehun Jo, Pierre Edinger, Simon J. Bleiker, Xiaojing Wang, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, Moises Jezzini, Jun Su Lee, Peter Verheyen, Iman Zand, Umar Khan, Wim Bogaerts, Göran Stemme, Kristinn B. Gylfason, and Frank Niklaus
Published in: Photonics Research, 2022, ISSN 2327-9125
Publisher: Optica Publishing Group and Chinese Laser Press (CLP)
DOI: 10.1364/prj.441215

Intellectual Property Rights

Patent (1)

MICRO ELECTROMECHANICAL RELAY

Application/Publication number: 20 1816954040
Date: 2018-12-20