Objective
The PLACYD project aims at strengthening the European leadership in the field of advanced lithography. The consortiums gathers the main European Rnull actors along the whole value chain (Material suppliers, equipment suppliers, semiconductor companies, CAD companies, research laboratories) in order to bring the key materials, processes and design tools for Directed Self Assembly (DSA) Lithography at the required industrial maturity for its introduction at the 1Xnode.
PLACYD is focused on challenges that must be addressed to
ensure the successful development and integration of Directed Self Assembly Lithography technology to support a high-volume integrated circuit (IC) manufacturing process and prepare the next generation nodes.
PLACYD will consist in defining and assembling the first pilot line to produce materials at the heart of the DSA technology. This will include a dedicated material synthesis and formulation pilot line that, as well as all the monitoring and characterisation means:
? to define the material specifications and prepare its introduction in IC fabs.
? to carry out statistical studies in 300mm line environment to understand correlations between material characteristics and application performances (CDU vs MW dispersity, Defectivity vs composition…)
? to demonstrate DSA technology maturity and compatibility to high volume IC manufacturing,
PLACYD will also define and qualify design tools that will allow designing guiding structure properly.Initially PLACYD will focus on contact shrink and contact doubling application. The project will deliver a Design module through its CAD partner as well as actual electrical demonstrators through its IC manufacturer partners.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
- engineering and technology mechanical engineering manufacturing engineering
- natural sciences physical sciences electromagnetism and electronics semiconductivity
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
ENIAC-2013-2
See other projects for this call
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
JTI-CP-ENIAC - Joint Technology Initiatives - Collaborative Project (ENIAC)
Coordinator
92800 PUTEAUX, LA DEFENSE
France
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.