The PLACYD project aims at strengthening the European leadership in the field of advanced lithography. The consortiums gathers the main European Rnull actors along the whole value chain (Material suppliers, equipment suppliers, semiconductor companies, CAD companies, research laboratories) in order to bring the key materials, processes and design tools for Directed Self Assembly (DSA) Lithography at the required industrial maturity for its introduction at the 1Xnode.
PLACYD is focused on challenges that must be addressed to
ensure the successful development and integration of Directed Self Assembly Lithography technology to support a high-volume integrated circuit (IC) manufacturing process and prepare the next generation nodes.
PLACYD will consist in defining and assembling the first pilot line to produce materials at the heart of the DSA technology. This will include a dedicated material synthesis and formulation pilot line that, as well as all the monitoring and characterisation means:
? to define the material specifications and prepare its introduction in IC fabs.
? to carry out statistical studies in 300mm line environment to understand correlations between material characteristics and application performances (CDU vs MW dispersity, Defectivity vs composition…)
? to demonstrate DSA technology maturity and compatibility to high volume IC manufacturing,
PLACYD will also define and qualify design tools that will allow designing guiding structure properly.Initially PLACYD will focus on contact shrink and contact doubling application. The project will deliver a Design module through its CAD partner as well as actual electrical demonstrators through its IC manufacturer partners.
Call for proposal
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Funding SchemeJTI-CP-ENIAC - Joint Technology Initiatives - Collaborative Project (ENIAC)