Technological solutions for wireless communications subsystems

Projektinformationen

TWICS

ID Finanzhilfevereinbarung: 21785

Projekt abgeschlossen

Startdatum 1 Februar 1996

Enddatum 31 Mai 1998

Finanziert unter

• Specific research and technological development programme in the field of information technologies, 1994-1998

Gesamtkosten € 4 000 000,00

EU-Beitrag € 2 000 000,00

Koordiniert durch

Mitel Semiconductor Limited
United Kingdom

Ziel

- The modification and unification of existing advanced IC, MCM, interconnection and subsystem integration technologies to realise lower cost, smaller size and lower weight wireless communications subsystems hardware.

- The generation of integrated design rules for the optimised IC, RF MCM-D, circuit card and assembly integration technologies.

- The design and manufacture of a flip chip MCM technology demonstrator for a 5.2 GHz W-LAN application.

Micro miniature radio hardware solutions are to be developed for mobile phone and Wireless Local Area Network (W-LAN) applications. Existing advanced IC, MCM, interconnection and subsystem integration technologies will be modified and optimised to provide reduced cost, smaller size and lower weight, portable communications product components. The integration of the TWICS technologies will be demonstrated in a set of wireless communications hardware functions.

Wissenschaftliches Gebiet

• engineering and technology › electrical engineering, electronic engineering, information engineering › information engineering › telecommunications › mobile phones
• engineering and technology › electrical engineering, electronic engineering, information engineering › information engineering › telecommunications › radio technology

Programm/Programme

• FP4-ESPRIT 4 - Specific research and technological development programme in the field of information technologies, 1994-1998

Thema/Themen

• 2.1 - Semiconductors - Microelectronics for product innovation

Aufforderung zur Vorschlagseinreichung

Data not available

Finanzierungsplan

CSC - Cost-sharing contracts

Koordinator

Mitel Semiconductor Limited

• EU-Beitrag: Keine Daten
• Adresse: Cheney Manor ; SN2 2QW Swindon ; Vereinigtes Königreich
• Gesamtkosten: Keine Daten

Beteiligte (2)

Ericsson Mobile Communications

Schweden

• EU-Beitrag: Keine Daten
• Adresse: 16480 Stockholm
• Gesamtkosten: Keine Daten

Stp Elekronische Systeme

Deutschland

• EU-Beitrag: Keine Daten
• Adresse: Tubinger Allee 49 ; 71065 Sindelfingen
• Gesamtkosten: Keine Daten