Objective
- The modification and unification of existing advanced IC, MCM, interconnection and subsystem integration technologies to realise lower cost, smaller size and lower weight wireless communications subsystems hardware.
- The generation of integrated design rules for the optimised IC, RF MCM-D, circuit card and assembly integration technologies.
- The design and manufacture of a flip chip MCM technology demonstrator for a 5.2 GHz W-LAN application.
Micro miniature radio hardware solutions are to be developed for mobile phone and Wireless Local Area Network (W-LAN) applications. Existing advanced IC, MCM, interconnection and subsystem integration technologies will be modified and optimised to provide reduced cost, smaller size and lower weight, portable communications product components. The integration of the TWICS technologies will be demonstrated in a set of wireless communications hardware functions.
Fields of science
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsmobile phones
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technology
Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
SN2 2QW Swindon
United Kingdom