Objetivo This project aims at developing 2-D micro-mirrors technology for scanning applications. Micro-mirrors are silicon-integrated mirrors of a few mm² that can oscillate at a few kHz. It shall use CMOS compatible processes for its realisation. This basic component will be packaged in a microsystem that will integrate optical and electronic functions. The die will be contained in a miniature Chip Scale Package with a cavity over the moving mirror region the assembly is to be delivered as a "ready to use" element for large dissemination. Such a technology will be demonstrated for barcode and symbols reading. It will enable optical scanning in general and will be useful for non-invasive endoscope, 3D cameras (acquisition of the third dimension with phase modulation). The project contributes to EC objectives by developing tools (scanners) for automatic identification, which is a basic request for food tracking, document and health management.Objectives:This project aims at developing 2 dimensions micro-mirrors technology for scanning applications. Micro-mirrors are silicon-integrated mirrors of a few mm² that can oscillate at a few kHz. It shall use CMOS compatible processes for its realisation. This basic component will be packaged in a microsystem that will integrate optical and electronic functions. The die will be contained in a miniature Chip Scale Package with a cavity over the moving mirror region the assembly is to be delivered as a "ready to use" element for large dissemination. Such a technology will be demonstrated for barcode and symbols reading. It will enable optical scanning in general and will be useful for non-invasive endoscope, 3D cameras (acquisition of the third dimension with phase modulation). The project contributes to EC objectives by developing tools (scanners) for automatic identification that is a basic request for food tracking, document and health management.Work description:The partners will develop both the micro-mirrors (2 independent directions oscillating mirrors) with its associated CMOS compatible process and the miniature CSP package to house the micro-mirror. Research has to be done to develop such a 2D 1mm² silicon micro-mirror by starting of first 1D micro-mirrors achievements. A double cardan-mounting mirror will be investigated. These micro-mirrors should oscillate in free mode with different patterns to scan the scene. A driving function will be also researched to ensure line scanning, raster pattern, turning line and other ways to scan images at several kHz. Other optical and electronic functions will be implemented to extract binary signal from the reflected light. Such a work should be independent from applications to enable different uses. The CSP package for the micro-mirror will be implemented by including a mechanical cavity in the package level manufacturing process. At a first step, the basic package outline will be designed, based on earlier packaging process for optical devices. At a second step, based on the process requirements, design rules for the micro-mirror as well as for micro-electromechanical devices will be processed and implemented through the micro-mirror integration. All these element (micro-mechanics, electronic, optic) will be integrated in a unique microsystem of less than 3 cm3 for use in many applications: bar-code/ring/pen readers, endoscope, cameras, etc. A concrete demonstrator will be also developed. It will be a hand held barcode scanner able to read 1D, stacked barcodes and low resolution 2D symbology. Such a scanner will be used for automatic identification applications with innovative performances for acquisition, volume, consumption, portability and lower cost compared with existing products. Ámbito científico engineering and technologymechanical engineeringmanufacturing engineeringengineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsoptical sensorsnatural scienceschemical sciencesinorganic chemistrymetalloids Programa(s) FP5-IST - Programme for research, technological development and demonstration on a "User-friendly information society, 1998-2002" Tema(s) 1.1.2.-4.7.3 - Microsystems Convocatoria de propuestas Data not available Régimen de financiación CSC - Cost-sharing contracts Coordinador INTERMEC SCANNER TECHNOLOGY CENTER Aportación de la UE Sin datos Dirección RUE DE LA DECOUVERTE 31670 LABEGE Francia Ver en el mapa Coste total Sin datos Participantes (3) Ordenar alfabéticamente Ordenar por aportación de la UE Ampliar todo Contraer todo FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. Alemania Aportación de la UE Sin datos Dirección HANSASTRASSE 27C 80686 MUENCHEN Ver en el mapa Coste total Sin datos SHELLCASE LIMITED Israel Aportación de la UE Sin datos Dirección MANHAT TECHNOLOGY PARK 96251 JERUSALEM Ver en el mapa Coste total Sin datos VALTRONIC SA Suiza Aportación de la UE Sin datos Dirección 92, VALLEE DE JOUX 1343 LES CHARBONNIERES Ver en el mapa Coste total Sin datos
