Project description
Next-Generation Nanoelectronics Components and Electronics Integration
The objective of CopPeR was to develop a seed-less copper deposition process and 300 mm wafer prototype equipment for sub-32 nm semiconductor interconnect manufacturing.
The CopPeR project will provide a novel copper deposition process based on the useof non-aqueous solvents to overcome the limitations of currently employedinterconnect formation processes enabling device scaling beyond the 32 nmtechnology node. This non-aqueous process will open novel routes to implementdirect on barrier plating, focussing on tantalum and ruthenium as diffusion barriers.As another main advantage the process developed and implemented within theCopPeR project will significantly improve the quality of the Cu metallization due to thefact that more space is available in trenches for high quality, low resistivity Cu, due tothe fact that the resistivity limiting seed-Cu will be eliminated and thinner barrier filmscan be applied, e.g. by ALD (atomic layer deposition).CopPeR will achieve the final goal through collaborations within a very strongconsortium based on a team with outstanding scientific, engineering andmanufacturing qualifications. In a first phase, electrolyte ingredients will be selectedand experimentally verified, a deposition cell designed through modelling andsimulation as well as new analytical techniques evaluated to enable adequateanalysis of the deposited films. The second phase will focus on the development ofthe copper deposition process based on the findings from phase one with theadditional support of micro-modelling and the process scaled and integrated into a300mm proof-of-concept. In the third and final phase, the process will be integratedinto a complete interconnect scheme, and optimized according to the industrial chipmanufacturer's needs.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
FP7-ICT-2007-1
See other projects for this call
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
9500 VILLACH
Austria
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.