Skip to main content

Copper Interconnects for Advanced Performance and Reliability

Project description


Next-Generation Nanoelectronics Components and Electronics Integration
The objective of CopPeR was to develop a seed-less copper deposition process and 300 mm wafer prototype equipment for sub-32 nm semiconductor interconnect manufacturing.

Call for proposal

FP7-ICT-2007-1
See other projects for this call

Coordinator

TECHNIKON FORSCHUNGS- UND PLANUNGSGESELLSCHAFT MBH
Address
Burgplatz 3a
9500 Villach
Austria

See on map

Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Klaus-Michael KOCH (Dr.)
EU contribution
€ 251 016

Participants (7)

LAM RESEARCH AG
Austria
EU contribution
€ 779 351
Address
Sez-strasse 1
9500 Villach

See on map

Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Fritz Pertl (Mr.)
TECHNISCHE UNIVERSITAET GRAZ
Austria
EU contribution
€ 525 452
Address
Rechbauerstrasse 12
8010 Graz

See on map

Activity type
Higher or Secondary Education Establishments
Administrative Contact
Gerald Kothleitner (Prof.)
ELSYCA NV
Belgium
EU contribution
€ 359 502
Address
Vaartdijk 3 Bus 603
3018 Wijgmaal

See on map

Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Tania Van Cauwenberghe (Ms)
KATHOLIEKE UNIVERSITEIT LEUVEN
Belgium
EU contribution
€ 641 930
Address
Oude Markt 13
3000 Leuven

See on map

Activity type
Higher or Secondary Education Establishments
Administrative Contact
Marion Wolpers (Ms)
VRIJE UNIVERSITEIT BRUSSEL
Belgium
EU contribution
€ 158 841
Address
Pleinlaan 2
1050 Brussel

See on map

Activity type
Higher or Secondary Education Establishments
Administrative Contact
Martina Follet (Ms.)
INFINEON TECHNOLOGIES AG
Germany
EU contribution
€ 245 918
Address
Am Campeon 1-15
85579 Neubiberg

See on map

Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Bernhard Scholz (Mr)
CORMET OY
Finland
EU contribution
€ 187 990
Address
Luutnantintie 3 A
00410 Helsinki

See on map

Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Juha Piippo (Dr.)