Objective The numerical analysis and prediction of the detailed behaviour of semiconductor devices is an important step in the development of a new process. With the advent of submicron feature sizes, this analysis is becoming increasingly difficult. For certain c alculations one-dimensional or two-dimensional analysis is no longer sufficiently accurate. 3-D analysis is only just becoming available inside certain major industries and is prohibitively expensive in computing time. The numerical analysis and prediction of the detailed behaviour of semiconductor devices is an important step in the development of a new process. With the advent of submicron feature sizes, this analysis is becoming increasingly difficult. For certain calculations one-dimensional or 2-dimensional analysis is no longer sufficiently accurate. 3-dimensional analysis is only just becoming available inside certain major industries and is prohibitively expensive in computing time.The main achievement of this project was to develop, for 3-dimensional devices, a set of fully testesd algorithms, initially for steady state analysis and later for transient and small siganl loading conditions. The interaction with the temperature of the crystal lattice was also taken into account. This implied crossing new research frontiers in nonlinear numerical analysis techniques to solve the problem reliably and within reasonable computing costs. As part of the drive to reduce computing costs, the applicability of computers with advanced architectures was investigated.The main achievement of this project was to develop, for 3D devices, a set of fully tested algorithms, initially for steadystate analysis and later for transient and small signal loading conditions. The interaction with the temperature of the crystal la ttice was also been taken into account. This implied crossing new research frontiers in nonlinear numerical analysis techniques to solve the problem reliably and within reasonable computing costs. As part of the drive to reduce computing costs, the appli cability of computers with advanced architectures was investigated. Following validation against measurements of real devices, the successful algorithms are being incorporated in computer systems in the industrial partners and in a common project researchcode. On the basis of the first year's work, a reappraisal of priorities led to an effort to augment the work-package aiming to produce the project research code. The definition of the plan for this work-package was greatly strengthened. This work culminated inthe delivery of the first release of the code for the solution of the initial target of the offstate 3D problem, demonstrated at the project review in December1987, with further enhancements shown in 1988. The validity of the results were demonstratedusing an agreed set of benchmarks in 1989. Fully transient 3D analysis at a reasonable computing cost is an ambitious goal. Even 2D solutions of this problem are only to be found inside large semiconductor companies (predominantly US and Japanese) at present, and it has been claimed that even these programs cannot solve all of the device problems in this category. The availability of such an analysis tool in Europe in 1990 puts Europe in a strongly competitive situation. In addition to the industrial use of the results by the companies in the project, the research project code will be made available to other European research organisations for research purposes. Fields of science natural sciencesphysical sciencesatomic physicsnatural sciencesphysical scienceselectromagnetism and electronicssemiconductivitynatural sciencesmathematicsapplied mathematicsnumerical analysis Programme(s) FP1-ESPRIT 1 - European programme (EEC) for research and development in information technologies (ESPRIT), 1984-1988 Topic(s) Data not available Call for proposal Data not available Funding Scheme Data not available Coordinator Rutherford Appleton Laboratory (RAL) EU contribution No data Address Chilton OX11 0QX Didcot United Kingdom See on map Total cost No data Participants (9) Sort alphabetically Sort by EU Contribution Expand all Collapse all ANALOG DEVICES BV Ireland EU contribution No data Address RAHEEN INDUSTRIAL ESTATE 1 LIMERICK See on map Total cost No data GEC-Marconi Materials Technology Ltd United Kingdom EU contribution No data Address Elstree Way WD6 1RX Borehamwood See on map Total cost No data IMEC VZW Belgium EU contribution No data Address KAPELDREEF 3030 HEVERLEE See on map Total cost No data NATIONAL MICROELECTRONICS RESEARCH CENTRE Ireland EU contribution No data Address PROSPECT ROW X CORK See on map Total cost No data NEDERLANDSE PHILIPS BEDRIJVEN BV Netherlands EU contribution No data Address KASTANJELAAN Postbus 218 5600 MD EINDHOVEN See on map Total cost No data Swansea University United Kingdom EU contribution No data Address Singleton park SA2 8PP SWANSEA See on map Links Website Opens in new window Total cost No data TRINITY COLLEGE DUBLIN Ireland EU contribution No data Address X DUBLIN 2 See on map Total cost No data Thomson Microelectronics Srl (SGS) Italy EU contribution No data Address Via Carlo Olivetti 20041 Agrate Brianza Milano See on map Total cost No data Università degli Studi di Bologna Italy EU contribution No data Address Viale Risorgimento 2 40136 Bologna See on map Total cost No data
