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Wide Angle and Resolution Metrology

Project description

Extremely high-resolution, wide-angle semiconductor metrology

Measuring features on small, flat parts such as semiconductor wafers conventionally involves magnifying certain areas and moving the components around via a stage to measure all parts. Field of view (FOV) measurement, measuring within the entire field of view, could significantly reduce the time and complexity of semiconductor wafer metrology. The Spanish SME WOOPTIX has developed a FOV metrology system based on wavefront phase imaging to measure the full 300 mm silicon wafer geometry with a lateral resolution of 3.2 µm and a height resolution of 0.3 nm in a single snapshot image in 100 ms. The EIC-funded WARM project will support the scale-up efforts to bring this disruptive metrology technology to market.

Objective

WOOPTIX will upgrade to a 300mm field of view (FoV) metrology system a ready-to-market 50mm field of view Wooptixs tool, based on a disruptive technology that measures the phase component of a beam of light (wavefront sensor) with a naked sensor, reaching a resolution orders of
magnitude higher than other wavefront sensors. This technology has been patented by the company. The scalability of the solution will present an outstanding business opportunity for WOOPTIX leading the company to achieve an amazing turnover rise. Our semiconductor metrology system is capable
of measuring the full 300mm silicon wafer geometry with a lateral resolution of 3.2m and a height resolution of 0.3nm acquired in a single image snapshot in 100ms while capturing 15 million data points. The system works by using a standard digital image sensor to acquire the intensity of
the reflected, non-coherent light from the silicon surface at two sperate locations along the optical path.

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Keywords

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Programme(s)

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Topic(s)

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

HORIZON-EIC-ACC-BF - HORIZON EIC Accelerator Blended Finance

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) HORIZON-EIC-2021-ACCELERATOROPEN-01

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Coordinator

WOOPTIX SL
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 2 500 000,00
Address
CALLE VELAZQUEZ, 110
28009 MADRID
Spain

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Comunidad de Madrid Comunidad de Madrid Madrid
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 6 357 210,00
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