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Quantum Photonic Integrated Circuit technologies (RIA)

 

Proposals will address technology (up to TRL 4-5) in key enabling PIC technology applied to market needs. Objectives include:

  • Enhancement of PIC performance, e.g. ultra-low loss; ultra-low laser linewidth; ultra-high extinction ratio modulators and switches , extending spectral and optical power coverage, optical coupling interfaces, packaging.
  • Incorporation of specific quantum functionality into PIC platforms, e.g. single photon and entangled photon pair generation, single photon and photon number detection , quantum memory elements, quantum processors.
  • Multi-technology integration, e.g. incorporation of ion/atomic traps and relevant control electronics, superconducting detectors, nonlinear elements, integration of photonic readout into quantum computing and sensing devices employing other technologies (e.g. electronic, spintronic), relevant passive and active linear optical elements (e.g. modulators, shifters, switches etc.) to underscore a strategy for modular QPIC design.
  • Development of PICs capable of operating at cryogenic temperatures, with low power dissipation and performance optimized in the context of the operating environment.
  • Development of the most promising methods for QPIC fabrication in monolithic, hybrid or heterogeneous integration techniques for different functionalities together with an identification of the most advantageous platform materials, (e.g. derived from “classical” PIC technologies such as Si, SiO2, Si3N4, InP, LiNbO3, Si-on-insulator, LiNbO3-on-insulator, Al2O3, AlN, hybrid platforms, etc. etc. etc.).
  • Assembly and packaging of PICs, taking the specific challenges of quantum systems (environment, temperature, stability, visible and ultraviolet wavelengths requirements, vacuum integration) into account and including integration of complementary and ancillary technologies (e.g. microelectronics) where required
  • Miniaturization of previously non-scalable quantum photonic systems by implementing them in PIC form.

Proposals should identify applications in quantum sensing, communication, computation and simulation. Proposals should test and evaluate the developed Quantum PIC technologies in the context of such specific applications though trials at systems level in a representative laboratory or an operational environment.

These technologies should be developed in a manner to facilitate scalable manufacturing. Proposals should address IP management strategy and collaboration with European industry and SMEs, in particular in the context of establishing relevant European industrial manufacturing capabilities.

Collaboration with the Quantum Flagship initiative and the photonics partnership is crucial to be able to merge knowledge and experience in photonic technologies and quantum science.

In this topic, the integration of the gender dimension (sex and gender analysis) in research and innovation content is not a mandatory requirement.