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Multiscale modelling and characterization to optimize the manufacturing processes of Organic Electronics materials and devices

Deliverables

Public presentation, Project Logo and website

Public presentation with publishable information on the project objectives, goals and consortium, on the project logo and on the project website

CORNET Database (first version)

First version of the CORNET Database for the OIE including modelling and characterization methodologies, data models, metadata implementation, wide-spread access and large data set performance, security, citation ability and screening/analytics capabilities)

CORNET Platform to support OIE (1 of 2)

First version of the CORNET Platform to support OIE that will include an interactive web-based tool to interconnect the entities in order to address problems in OE model validation with experimental characterization, to establish communication between entities, to catalogue competences/activities/infrastructures and to provide framework for networking and mobility for training

Intermediate Report on Dissemination and Communication

Report on the dissemination and communication activities of the partners to promote the project results during the Reporting Period 1 (M1-M18)

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Publications

P‐176: Quantitative Analysis of Charge Transport in Single‐Carrier Devices and OLEDs Combining DC and AC Data

Author(s): Sandra Jenatsch, Simon Züfle, Paul-Anton Will, Balthasar Blülle, Martin Neukom, Simone Lenk, Sebastian Reineke, Daniele Braga, Konrad Domanski, Beat Ruhstaller
Published in: SID Symposium Digest of Technical Papers, Issue 50/1, 2019, Page(s) 1895-1898, ISSN 0097-966X
DOI: 10.1002/sdtp.13333

Tin( iv ) dopant removal through anti-solvent engineering enabling tin based perovskite solar cells with high charge carrier mobilities

Author(s): R. M. I. Bandara, K. D. G. I. Jayawardena, S. O. Adeyemo, S. J. Hinder, J. A. Smith, H. M. Thirimanne, N. C. Wong, F. M. Amin, B. G. Freestone, A. J. Parnell, D. G. Lidzey, H. J. Joyce, R. A. Sporea, S. R. P. Silva
Published in: Journal of Materials Chemistry C, Issue 7/27, 2019, Page(s) 8389-8397, ISSN 2050-7534
DOI: 10.1039/c9tc02003a