Skip to main content

3D Multi-Process Sequential Integration for Smart Sensor Interfaces

Objective

The IoT is composed of connected devices that are characterized by their interaction with the environment via a plethora of sensors and actuators. The trend goes to ever more complex interactions and thus an increase in the number of different sensors integrated in the same product, which in turn requires the processing capability to handle all of those sensors.

At the same time those systems are expected to still perform on an ever lower power budget, preferably so low as to be able to operate purely on power scavenging. And of course the cost needs to be moderate too. The electronics at the heart of such a system needs to be mixed-signal electronics that interfaces to the analog sensors and actuators, but can also provide the necessary digital processing power.

3D-MUSE wants to spearhead the progression from what we shall refer to as 'systems-in-stack' to true 'systems-in-cube' that monolithic/sequential 3D integration will enable. We define the former as a 3D system that is characterized by locating functional blocks within a single plain in the (typically parallel/wafer-bonding) 3D integration stack, while the latter makes use of the full emancipation of the interconnect density in the third dimension of sequential 3D integration and rather implements functional blocks in a volume comprising multiple tiers. We shall demonstrate this concept by conceiving novel architectures for micro circuits in a volume in a two tier 3D sequential integration process. In particular, we have identified mixed-signal circuits as, on one hand, a major bottleneck for functional performance scaling of sensor nodes and smart sensors in the IoT and cyberphysical systems, and on the other hand, excellent candidates for beneficial trade-offs when implemented as circuits in a volume with using two specialize tiers, one for analog device options and another for optimal digital designs. We shall refer to such a technology as 'multi-process' sequential 3D integration.

Field of science

  • /natural sciences/computer and information sciences/internet/internet of things

Call for proposal

H2020-ICT-2017-1
See other projects for this call

Funding Scheme

RIA - Research and Innovation action

Coordinator

UNIVERSITETET I OSLO
Address
Problemveien 5-7
0313 Oslo
Norway
Activity type
Higher or Secondary Education Establishments
EU contribution
€ 590 891,25

Participants (5)

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
France
EU contribution
€ 1 607 728,75
Address
Rue Leblanc 25
75015 Paris 15
Activity type
Research Organisations
LUNDS UNIVERSITET
Sweden
EU contribution
€ 393 527,50
Address
Paradisgatan 5C
22100 Lund
Activity type
Higher or Secondary Education Establishments
INTEGRATED DETECTOR ELECTRONICS AS
Norway
EU contribution
€ 753 125
Address
Gjerdrums Vei 19
0484 Oslo
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
STMICROELECTRONICS CROLLES 2 SAS
France
EU contribution
€ 350 885
Address
Rue Jean Monnet 850
38920 Crolles
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
INSTITUT POLYTECHNIQUE DE GRENOBLE
France
EU contribution
€ 150 000
Address
Avenue Felix Viallet 46
38031 Grenoble Cedex 1
Activity type
Higher or Secondary Education Establishments