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Content archived on 2024-05-14

Technological solutions for wireless communications subsystems

Objective

- The modification and unification of existing advanced IC, MCM, interconnection and subsystem integration technologies to realise lower cost, smaller size and lower weight wireless communications subsystems hardware.

- The generation of integrated design rules for the optimised IC, RF MCM-D, circuit card and assembly integration technologies.

- The design and manufacture of a flip chip MCM technology demonstrator for a 5.2 GHz W-LAN application.

Micro miniature radio hardware solutions are to be developed for mobile phone and Wireless Local Area Network (W-LAN) applications. Existing advanced IC, MCM, interconnection and subsystem integration technologies will be modified and optimised to provide reduced cost, smaller size and lower weight, portable communications product components. The integration of the TWICS technologies will be demonstrated in a set of wireless communications hardware functions.

Fields of science (EuroSciVoc)

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Programme(s)

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Topic(s)

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Call for proposal

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Funding Scheme

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CSC - Cost-sharing contracts

Coordinator

Mitel Semiconductor Limited
EU contribution
No data
Address
Cheney Manor
SN2 2QW Swindon
United Kingdom

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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

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Participants (2)

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