Cel
For several decades, silicon semiconductor devices have been scaled down to achieve higher device density and performance. As a result, alternative gate oxides with high dielectric constant (high-k), which can prevent power dissipation resulting from direct quantum mechanical tunneling across the dielectric layer, will replace silicon dioxide which has been used as a gate dielectric in metal-oxide-semiconductor field effect transistors. Deposited hafnium oxide-based insulators are currently the most promising high-k materials for MOS device applications. However, it has been consistently observed that high-k based MOSFETs have problems such as reduced mobility of electronic carriers in the transistor channel, difficulty in setting the threshold voltage (Vth) for CMOS devices, Vth instability, and other device reliability problems. Further improvements require a fundamental understanding of these phenomena.
The second aim of this work is the study of Materials for High-Mobility-Channel MOS. Due to their superior properties such as high electron and hole mobility, Ge and III-V materials have been drawing much attention as a high-mobility-channel layer in the future MOS technology. However, there are some major issues that need to be solved to advance the development of high-mobility-channel MOS such as growth of good quality high k dielectric layer with low interface states
Dziedzina nauki
Zaproszenie do składania wniosków
FP7-PEOPLE-2010-IOF
Zobacz inne projekty w ramach tego zaproszenia
System finansowania
MC-IOF - International Outgoing Fellowships (IOF)Koordynator
08193 Cerdanyola Del Valles
Hiszpania