Ziel
Avionics and electronic equipment manufacturers are facing technological challenges linked to miniaturisation and cost reduction. The obstacles to more competitive integration in the products are thermal management and lack of standardisation. Electronic integration development cannot be conducted only in the avionics sector although it is often the most demanding in term of miniaturisation and weight reduction. 3D packaging enable many components made by different technologies to be combined in a single package and offer many advantages: systems performance, increased speed, miniaturisation, reduction of volume and weight, power efficiency and more reliability. In spite of overall reduction in power consumption the power densities are high in the embedded structures, resulting in limited module total power dissipation (max 10 W), and the proposed RTD aim at solving this problem (objective 30 W) by the use of micro heat pipes. Miniaturisation is a requirement for survival and competitiveness: it helps saving resources and opening new markets.