Objective FLEXIL project deals with the development of highly integrated man-machine interfaces based on flex interconnection technology.Applications focused are:- large LCDs applied into the harsh environment of avionics (Airbus or automotive), that require high density connection to feed the power and the data to the LCD from the symbol generators and the power supplies,- very flat, integrated small displays for smart cards or portable electronics that require also low cost- high density flexes and high density assembly processes like flip chip on flex, and micro-packages surface mount on flex.FLEXIL project objective is to develop very advanced Flex based technologies and related innovative assembly processes to put European industry in a position to manufacture better flat panel displays and electronic integrated products for high end (avionics, automotive) and high volume applications (smart cards, telecom).Objectives:FLEXIL project objective is to develop very advanced Flex based technologies and related innovative assembly processes to put European industry in a position to manufacture better flat panel displays and electronic integrated products for high end (avionics, automotive) and high volume applications (smart cards, telecom).Particularly FLEXIL is focused on:- very fine pitch tapes (54 µm), and flex for flip chip (80 µm),- surface mount and anisotropic gluing processes,L%- reliability of the technologies developed for severe environments.Applications focused are:- large LCDs applied into the harsh environment of avionics (Airbus or automotive), that require high density connection to feed the power and the data to the LCD from the symbol generators and the power supplies,- very flat, integrated small displays for smart cards or portable electronics that require also low cost- high density flexes and high density assembly processes like flip chip on flex, and micro-packages surface mount on flex.Work description:Five workpackages represent the structure of the project.Technology Tasks and Work Packages are entitled as follows:- WP1 Specifications & Requirements- WP2 Development of LCD ASIC Drivers (2)- WP3 Technologies development3.1 High density (54um)Flex / Tab and flex for flip-chip technology development3.2 Flex Tab and flex for flip chip design and fabrication3.3 Assembly process developments3.3.a Bumpless Flex Tab chip assembly3.3.b Flip chip on flex connections (80 µm)3.3.c Surface mount microcomponents assembly on flex3.4 Flex to glass anisotropic adhesive connection development (54 um pitch)3.5 High density bumping process for flip chip (80um pitch)- WP4 Techno Evaluation & Demonstrator Fabrication- WP5 Technology Validation & ExploitationThe project synopsis, depicts the synergetics structure of the programme, from the development and the qualification of technologies to the manufacture of functional products.Each work package gathers the relevant partners that are needed for reaching the Task or Demonstrator objectives in view of the whole project goal. Fields of science engineering and technologymaterials engineering Programme(s) FP5-IST - Programme for research, technological development and demonstration on a "User-friendly information society, 1998-2002" Topic(s) 1.1.2.-4.7.2 - Subsystems technologies Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator THALES SYSTEMES AEROPORTES S.A. EU contribution No data Address 2, AVENUE GAY-LUSSAC LA CLEF DE SAINT PIERRE 78990 ELANCOURT France See on map Total cost No data Participants (6) Sort alphabetically Sort by EU Contribution Expand all Collapse all BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM Hungary EU contribution No data Address MUEGYETEM RAKPART 3 1111 BUDAPEST See on map Total cost No data ELCOTEQ NETWORK CORPORATION Finland EU contribution No data Address LAENSI-LOUHENKATU 31 08101 LOHJA See on map Total cost No data FCI MICRO ELECTRONICS France EU contribution No data Address RUE DES CLOSEAUX 37 78200 MANTES LA JOLIE See on map Total cost No data INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW Belgium EU contribution No data Address KAPELDREEF 75 3001 LEUVEN See on map Total cost No data THALES AVIONICS LCD SA France EU contribution No data Address BOULEVARD HAUSSMANN 173 75008 PARIS See on map Total cost No data THALES AVIONICS SA France EU contribution No data Address 1 AVENUE CARNOT 91883 MASSY See on map Total cost No data