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Fine Pitch / High Density Flex Interconnection

Objective

FLEXIL project deals with the development of highly integrated man-machine interfaces based on flex interconnection technology.

Applications focused are:
- large LCDs applied into the harsh environment of avionics (Airbus or automotive), that require high density connection to feed the power and the data to the LCD from the symbol generators and the power supplies,
- very flat, integrated small displays for smart cards or portable electronics that require also low cost
- high density flexes and high density assembly processes like flip chip on flex, and micro-packages surface mount on flex.

FLEXIL project objective is to develop very advanced Flex based technologies and related innovative assembly processes to put European industry in a position to manufacture better flat panel displays and electronic integrated products for high end (avionics, automotive) and high volume applications (smart cards, telecom).

Objectives:
FLEXIL project objective is to develop very advanced Flex based technologies and related innovative assembly processes to put European industry in a position to manufacture better flat panel displays and electronic integrated products for high end (avionics, automotive) and high volume applications (smart cards, telecom).

Particularly FLEXIL is focused on:
- very fine pitch tapes (54 µm), and flex for flip chip (80 µm),
- surface mount and anisotropic gluing processes,L%- reliability of the technologies developed for severe environments.

Applications focused are:
- large LCDs applied into the harsh environment of avionics (Airbus or automotive), that require high density connection to feed the power and the data to the LCD from the symbol generators and the power supplies,
- very flat, integrated small displays for smart cards or portable electronics that require also low cost
- high density flexes and high density assembly processes like flip chip on flex, and micro-packages surface mount on flex.

Work description:
Five workpackages represent the structure of the project.
Technology Tasks and Work Packages are entitled as follows:
- WP1 Specifications & Requirements
- WP2 Development of LCD ASIC Drivers (2)
- WP3 Technologies development
3.1 High density (54um)Flex / Tab and flex for flip-chip technology development
3.2 Flex Tab and flex for flip chip design and fabrication
3.3 Assembly process developments
3.3.a Bumpless Flex Tab chip assembly
3.3.b Flip chip on flex connections (80 µm)
3.3.c Surface mount microcomponents assembly on flex
3.4 Flex to glass anisotropic adhesive connection development (54 um pitch)
3.5 High density bumping process for flip chip (80um pitch)
- WP4 Techno Evaluation & Demonstrator Fabrication
- WP5 Technology Validation & Exploitation
The project synopsis, depicts the synergetics structure of the programme, from the development and the qualification of technologies to the manufacture of functional products.
Each work package gathers the relevant partners that are needed for reaching the Task or Demonstrator objectives in view of the whole project goal.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

THALES SYSTEMES AEROPORTES S.A.
Address
2, Avenue Gay-lussac La Clef De Saint Pierre
78990 Elancourt
France

Participants (6)

BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM
Hungary
Address
Muegyetem Rakpart 3
1111 Budapest
ELCOTEQ NETWORK CORPORATION
Finland
Address
Laensi-louhenkatu 31
08101 Lohja
FCI MICRO ELECTRONICS
France
Address
Rue Des Closeaux 37
78200 Mantes La Jolie
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Belgium
Address
Kapeldreef 75
3001 Leuven
THALES AVIONICS LCD SA
France
Address
Boulevard Haussmann 173
75008 Paris
THALES AVIONICS SA
France
Address
1 Avenue Carnot
91883 Massy