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Technological solutions for wireless communications subsystems

Objectif

- The modification and unification of existing advanced IC, MCM, interconnection and subsystem integration technologies to realise lower cost, smaller size and lower weight wireless communications subsystems hardware.

- The generation of integrated design rules for the optimised IC, RF MCM-D, circuit card and assembly integration technologies.

- The design and manufacture of a flip chip MCM technology demonstrator for a 5.2 GHz W-LAN application.

Micro miniature radio hardware solutions are to be developed for mobile phone and Wireless Local Area Network (W-LAN) applications. Existing advanced IC, MCM, interconnection and subsystem integration technologies will be modified and optimised to provide reduced cost, smaller size and lower weight, portable communications product components. The integration of the TWICS technologies will be demonstrated in a set of wireless communications hardware functions.

Appel à propositions

Data not available

Régime de financement

CSC - Cost-sharing contracts

Coordinateur

Mitel Semiconductor Limited
Contribution de l’UE
Aucune donnée
Adresse
Cheney Manor
SN2 2QW Swindon
Royaume-Uni

Voir sur la carte

Coût total
Aucune donnée

Participants (2)