Objective
FLEXIL project deals with the development of highly integrated man-machine interfaces based on flex interconnection technology.
Applications focused are:
- large LCDs applied into the harsh environment of avionics (Airbus or automotive), that require high density connection to feed the power and the data to the LCD from the symbol generators and the power supplies,
- very flat, integrated small displays for smart cards or portable electronics that require also low cost
- high density flexes and high density assembly processes like flip chip on flex, and micro-packages surface mount on flex.
FLEXIL project objective is to develop very advanced Flex based technologies and related innovative assembly processes to put European industry in a position to manufacture better flat panel displays and electronic integrated products for high end (avionics, automotive) and high volume applications (smart cards, telecom).
Objectives:
FLEXIL project objective is to develop very advanced Flex based technologies and related innovative assembly processes to put European industry in a position to manufacture better flat panel displays and electronic integrated products for high end (avionics, automotive) and high volume applications (smart cards, telecom).
Particularly FLEXIL is focused on:
- very fine pitch tapes (54 µm), and flex for flip chip (80 µm),
- surface mount and anisotropic gluing processes,L%- reliability of the technologies developed for severe environments.
Applications focused are:
- large LCDs applied into the harsh environment of avionics (Airbus or automotive), that require high density connection to feed the power and the data to the LCD from the symbol generators and the power supplies,
- very flat, integrated small displays for smart cards or portable electronics that require also low cost
- high density flexes and high density assembly processes like flip chip on flex, and micro-packages surface mount on flex.
Work description:
Five workpackages represent the structure of the project.
Technology Tasks and Work Packages are entitled as follows:
- WP1 Specifications & Requirements
- WP2 Development of LCD ASIC Drivers (2)
- WP3 Technologies development
3.1 High density (54um)Flex / Tab and flex for flip-chip technology development
3.2 Flex Tab and flex for flip chip design and fabrication
3.3 Assembly process developments
3.3.a Bumpless Flex Tab chip assembly
3.3.b Flip chip on flex connections (80 µm)
3.3.c Surface mount microcomponents assembly on flex
3.4 Flex to glass anisotropic adhesive connection development (54 um pitch)
3.5 High density bumping process for flip chip (80um pitch)
- WP4 Techno Evaluation & Demonstrator Fabrication
- WP5 Technology Validation & Exploitation
The project synopsis, depicts the synergetics structure of the programme, from the development and the qualification of technologies to the manufacture of functional products.
Each work package gathers the relevant partners that are needed for reaching the Task or Demonstrator objectives in view of the whole project goal.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
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Programme(s)
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Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
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Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
78990 ELANCOURT
France
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.