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Fraunhofer Technology Platform Microencapsulation

Thanks to microencapsulated ingredients, many products that were considered technically unfeasible are now possible, and the microencapsulation technology still has the potential to offer profitable applications in different industrial sectors.

The objective of the Fraunhofer Technology Platform Microencapsulation is to support industrial partners in exploring this possibilities and translating them into market products. Over the last year the Fraunhofer Institute for Industrial Engineering IAO (Stuttgart) and the Fraunhofer Institute for Advanced Polymer Research IAP (Potsdam-Golm) have developed a Technology Platform Microencapsulation, which has been demonstrated in several industries from paper and chemistry to personal care to have great benefits and advantages, such as a recognized support for the identification and for a deep insight in those applications and an unique possibility to get a constant update in the technical progresses. The Technology Platform Microencapsulation is facing the completion of the first phase and the project is approaching its second phase. The Fraunhofer Technology Platform Microencapsulation experts are devoted to the scouting and analysis of technology trends, elaboration of market data and IP monitoring; all the information and studies are then customized to the platform industrial participants’ needs and requirements. The companies joining the network receive quarterly newsletters reporting on scientific advances in microencapsulation methods, materials and applications, on collaboration possibilities and funding, and including IP monitoring through patent watching. The market potential of the newest technologies is estimated in the annually realized Technology Potential Analysis which gives the option of being completed by a workshop organized by the Fraunhofer researchers. The Fraunhofer Technology Platform Microencapsulation offers networking opportunities through an on-line portal and regular meetings and seminars spread over the year. Platform’s participants also benefit of special registration offers to Fraunhofer conferences such as the Forum Business Model Innovation: new application possibilities in microencapsulation, the third edition of which will take place on the 28th October 2010 at the Fraunhofer IAP in Potsdam-Golm (Germany). The first phase of the Platform project will be completed in January 2010, the second phase of the project of the duration of two years, will officially start on the 22nd February 2010 with a Kick-off meeting which will take place at the Fraunhofer IAO in Stuttgart (Germany). This technology and network offering is ideally conceived for companies working in specific industries with their own encapsulation challenges or companies that currently have their own encapsulation systems and products, and are keen to strengthen and broaden their offering by engaging with what is an excellent and complementary system. Detailed information on the Fraunhofer Technology Platform Microencapsulation are available in the below reported link. If you are interested in becoming a member of the platform the Fraunhofer researchers will be available for any further questions you may have.


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