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High density connection implementation

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Micro-printing presents mega advantages

Advanced electronics require micro-precise circuit interconnection finer than industry standard 200 micro-metres thick film printing. The micro Screen, a product from ERA Technology and MCI attains far greater precision and at cheaper costs than competing patterning technologies.

Digital Economy

Conventional circuit board printing requires extremely high tech procedures that can produce tracks and spaces between tracks of up to 200 micro-metres. These are procured through the use of thin-film technology, a highly expensive resource which requires the additional treatment of precision laser trimming. Using standard screen frames, a stainless steel foil micro-etched with ink-feeder holes and having a underlay of organic gasketing to ensure ink-flow accuracy, the micro-Screen produces thick film track definition to an astounding micro-tracking of 50 micro-metres. It therefore, reduces the need for laser trimming, track multi-layering and hence, offers screen print manufacturing significant advances without major capital outlays. The micro-Screen allows for unique patterning of circuitry through standard CAD design programs effectively permitting each micro-Screen foil mesh to be unique and tailor designed. Because it requires no special engineering, micro-Screen can utilise thick-film technology, standard printing processes and produces far better results than thin-film and photo-imaging techniques. This technology, currently ready for demonstration, has shown best results with microwave circuits, reducing the need for high-tech interconnect components, improving track edge definition and enhanced circular or radial tracks that do not have random edge effects associated with current printing technologies. Micro-Screen may be making minute tracks in screen printing, but with all the advantages it presents, it should promote considerable benefits to micro-printing technologies. More information can be found at:

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