Fifth 'Eureka initiative for packaging and integration of devices and smart card systems' Forum, Helsinki, Finland
Sponsored by the 'Eureka initiative for packaging and integration of devices and smart card systems' (Euripedes) initiative, the event will gather smart system stakeholders and feature dedicated events aiming at generating ideas for future business. A number of sub-events will take place during and around the time of the forum.
A workshop organised by the European Technology Platform on Smart Systems Integration (Eposs) will feature expressions of interests and to project ideas for future Eureka and European calls or other funding opportunities.
The 'New business and innovations from electronic components' segment will help small- and medium-sized businesses with access to smart system technologies, international networking and using European funding schemes to create new competitive advantages.
A session entitled 'Easy access to microsystems production through contract manufacturing services' will feature the increasing use of microsystems to bridge the innovation gap from laboratory to manufacturing.
There will also be a networking and marketing area for miniaturised smart systems. Entitled the 'Cowin marketplace', visitors will have the chance to meet with experts to discuss available public financing opportunities for individual projects or needs. Dedicated resources will also be made available for networking and meeting potential project partners. The marketplace is co-sponsored by the EU-funded 'Converging resources to support the value creation in Europe of microsystems and smart miniaturised systems research projects' (Cowin) project.For further information, please visit: http://www.euripides-eureka.eu/(opens in new window)