'SMT Hybrid Packaging 2013', Nuremberg, Germany
16 April 2013 - 16 April 2013
Germany
An event entitled 'SMT Hybrid Packaging 2013' will be held from 16 to 18 April 2013 in Nuremberg, Germany.
Organised by Mesago, SMT Hybrid Packaging is an international information platform for all those interested in the latest trends in the field of System Integration in Micro Electronics. In addition to two conferences, 19 half-day tutorials and two workshops will be organised.
The event will also consist of an exhibition where expert, decision makers, journalists and the broader public will find out about new products and potential investments, from design and development to PCB production, components, assembly, soldering, packaging and test systems.For further information, please visit:
http://www.mesago.de/en/SMT/home.htm(opens in new window)
Organised by Mesago, SMT Hybrid Packaging is an international information platform for all those interested in the latest trends in the field of System Integration in Micro Electronics. In addition to two conferences, 19 half-day tutorials and two workshops will be organised.
The event will also consist of an exhibition where expert, decision makers, journalists and the broader public will find out about new products and potential investments, from design and development to PCB production, components, assembly, soldering, packaging and test systems.For further information, please visit:
http://www.mesago.de/en/SMT/home.htm(opens in new window)