It is our great pleasure to be able to share photos of some of the building blocks of the heterogeneous M2DC platform – the heterogeneous M2DC server system with integrated microservers and hardware accelerators; CPUs (x86, ARM32, ARM64), integrated CPUs/GPUs (NVIDIA TX1/TX2) and FPGAs.
New products and technologies
With a blade-style design, the platform integrates up to 144 low-power microservers or 27 high-performance microservers in a single 3HE chassis. Microservers are based on established Computer on Module standards (COM Express, Nvidia Jetson, Toradex Apalis) with novel microservers developed for M2DC including the ARM64 Microserver and the Intel Stratix 10 Microserver.
ARM64 Microserver Key Specifications |
COM Express Type 7 form factor 32 Core Cortex-A72 @ 2.1 GHz 48 kByte L1 I-Cache, 32 kByte L1 D-Cache per Core 8 MByte L2 Cache 32 MByte L3 Cache 4x DDR4 ECC SO-DIMM (up to 128 GByte, quad channel) 4x 10GBASE-KR, 1000BASE-T, 2x SAS, USB 3x PCIe 3.0 x8 Onboard SD card and eMMC flash Support Multi-Socket configurations
COM Express Type 7 form factor High-density FPGA fabric, 2800 logic elements Quad-core Cortex-A53 @ 1.5 GHz On board 56 GByte DDR4 + ECC (quad channel) 4x 10GBASE-KR, 1000BASE-T, 2xSAS, USB, SDI/DP 4x PCIe 3.0 x16 Onboard eMMC flash
M2DC PLATFORM | The server chassis will fit the microservers developed within M2DC as well as different types of microservers available on the market, and provide a flexible, high-speed, low-latency communication infrastructure between then.
You are invited to see the new M2DC platform at the following events in 2018:
HiPEAC CSW Spring 2018, Gothenburg - Sweden, May 22-24, 2018 E2DC Workshop, Karlsruhe - Germany, June 12, 2018 Forum Teratec, Paris - France, June 19-20, 2018 ISC 2018, Frankfurt - Germany, June 24-28, 2018 SC 2018, Dallas - US, November 11-16, 2018