Active Building Blocks for Visible and Near-Infrared Applications on a Silicon Nitride Interposer

Project Information

VISSION

Grant agreement ID: 101070622

DOI

10.3030/101070622

EC signature date 23 June 2022

Start date 1 September 2022

End date 31 August 2027

Funded under

• Digital, Industry and Space

Total cost

€ 4 151 212,50

EU contribution

€ 4 151 212,50

Coordinated by

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium

Periodic Reporting for period 2 - VISSION (Active Building Blocks for Visible and Near-Infrared Applications on a Silicon Nitride Interposer)

Reporting period: 2024-03-01 to 2025-08-31

Summary of the context and overall objectives of the project

VISSION's overall objective is the extension of the silicon nitride (SiN) photonic integrated circuit (PIC) platform for the visible and near-infrared wavelength range (400 nm–1100 nm), with active building blocks including sources, detectors, and modulators. This is the spectral range of many biomedical applications, environmental sensing, and emerging applications such as the field of quantum sciences. Applications include optical coherence tomography (OTC), flow cytometry, environmental sensors to detect water pollution, quantum computers, and atomic clocks, which will benefit from an integrated active photonic platform at visible and near-IR wavelengths.
To reach the overall objective, we break it into the following intermediate objectives:
A. Demonstration of a platform that is broadband, covering the range 400 nm – 1100 nm.
B. Demonstration of the future-proof modular integration techniques needed to integrate active generic components on the silicon nitride (SiN) interposer.
C. Demonstration of the application-specific system and sub-system circuits that include both the actives and passives.
D. Development of a strategy that allows for wide accessibility to the platform for photonic designers.

Work performed from the beginning of the project to the end of the period covered by the report and main results achieved so far

During the second reporting period of the VISSION project, substantial progress was made across multiple work packages, advancing toward the project's core objectives.
Key achievements include:
PDK Development and Design Infrastructure
• The Photonic Design Kit (PDK) was updated to incorporate initial models for newly developed components, enhancing simulation accuracy and design reliability.
• A data analysis framework was developed to systematically evaluate measurement results and provide feedback for model refinement.
• These efforts have significantly strengthened the design infrastructure of the VISSION platform, ensuring robust support for future fabrication runs and system-level integration.
Fabrication and Characterization
• The SiN1 and SiN2 fabrication runs were successfully completed.
• Devices from the SiN1 run underwent partial characterization, offering valuable insights for design optimization.
Electrically Operated III-Nitride Amplifiers
• A major effort was dedicated to demonstrating electrically operated III-Nitride amplifiers via micro-transfer printing (MTP), as reported in Deliverable D3.4.
• Despite delays caused by process challenges and the need for alternative approaches, a functional flip-chip mounted laser diode was successfully demonstrated.
• A printed gain chip on a circuit with two Sagnac loop mirrors formed a Fabry-Perot laser, showing lasing at ~975 nm with a threshold current of ~25 mA and an on-chip power of 0.5 mW at 40 mA.
• Adding a second gain chip as a booster increased the on-chip power to 4 mW, validating the full process chain from gain chip fabrication (FBH), underetching, and MTP (imec).
Electro-Optic Modulation and Photodetectors
• BTO and PZT coupons were successfully micro-transfer printed, and modulation was demonstrated, although further optimization is needed.
• Photodetectors (PDs) were fabricated using imec’s iSPP50G platform, and MTP integration is currently ongoing.
Design Contributions and Demonstrator Development
• G&H contributed to the design activities for the SiN2 run and performed device-level characterization of components from SiN1, supporting the development of the OCT demonstrator.
• Sarcura, in close collaboration with imec, focused on designing SiN2 structures relevant to the Flow Cytometry demonstrator, and initiated preliminary characterization to guide further development.

Progress beyond the state of the art and expected potential impact (including the socio-economic impact and the wider societal implications of the project so far)

During this reporting period, the VISSION project has made notable advancements that push the boundaries of current photonic integration technologies and design methodologies.
These achievements represent significant progress beyond the state of the art in several key areas:
Technological Advancements Beyond the State of the Art:
• Direct Micro-Transfer Printing (MTP) of functional materials such as PZT and BTO onto SiN photonic platforms was successfully demonstrated without the need for intermediate bonding layers (e.g. BCB). This innovation improves field overlap and device performance, enabling more compact and efficient electro-optic modulators.
• Electrically operated III-Nitride amplifiers were demonstrated through a complex integration process involving gain chip fabrication, underetching, and MTP. The successful realization of a Fabry-Perot laser and booster amplifier with high on-chip power validates the full process chain and sets a new benchmark for hybrid integration of active components.
• The development of a data analysis framework and integration of initial component models into the PDK significantly enhance the design flow, enabling more accurate simulations and faster iteration cycles.
• Novel device designs submitted for the SiN2 run, including high extinction ratio switches, asymmetric add-drop ring resonators, and Vernier filters, introduce new functionalities and improved performance metrics not present in earlier runs.
Expected Socio-Economic Impact
• The project’s innovations in hybrid integration and scalable fabrication processes pave the way for cost-effective, high-performance photonic systems, which are essential for next-generation applications in healthcare, communications, and sensing.
• The demonstrated integration of III-Nitride gain chips and electro-optic modulators supports the development of compact and energy-efficient light sources and signal processors, which are critical for miniaturized diagnostic tools and high-speed data transmission.
• Contributions to the OCT and Flow Cytometry demonstrators by partners such as IMEC, G&H and Sarcura highlight the project’s relevance to biomedical applications, with potential impact on early disease detection, cell analysis, and personalized medicine.
• The strengthened design infrastructure and validated fabrication processes contribute to European leadership in photonic integration, supporting industrial competitiveness and fostering innovation across sectors.