Periodic Reporting for period 1 - MWP4SPACE (MicroWave Photonic Technologies for Communications and Sensing Applications in Space)
Reporting period: 2022-10-01 to 2024-09-30
The MWP4SPACE IDN will train the next generation of specialists in Integrated Microwave Photonic (IMWP) devices and systems in the framework of satellite and space applications. They will gain skills to integrate compact photonic and radio frequency (RF) circuits, and cutting-edge knowledge of photonic integrated circuit (PIC) design, fabrication, packaging, validation and qualification both at the device and system level – competences for which there is a fast-growing demand in the global satellite industry, but that are rarely taught in an integrated training program. MWP4SPACE will offer a unique education program for 15 young researchers structured in research projects and network-wide training activities and delivered by 6 European Universities, 1 non-profit academic research institutions and 9 companies which are world-class references in both photonics and space technologies.
For European research and industry to remain competitive in the area of IMWP, they need scientific knowledge as well as suitable entrepreneurial scientists, that have expert multidisciplinary knowledge and strong understanding of integrated photonics (as it is KET in the EU), optoelectronics, industrial processes, automation and circuit design and layout, InP software simulation and modelling and a broad academic and industrial network.
In terms of training, the participants, as individual academic institutions as well as members of the MWP4SPACE network, will deliver the Doctoral Candidates or DCs’ with an excellent foundation for their future career through integrated training far beyond what would be possible through work at any single institution. Besides, the MWP4SPACE project will develop a framework for structuring doctoral training at the European level between excellent participants from academic and non-academic sectors as well as having a significant impact on structuring the doctoral research training capacity of the partners.
Concerning DCs careers, during the project MWP4SPACE will build upon the existing active collaborations and establish new ones by bringing the collaborating groups together, through secondments and networking events. After the project the MWP4SPACE network will aim to sustain itself after the project both for research collaboration and for long lasting, future training of interdisciplinary young researchers and PhD students.
For European research and industry to remain competitive in the area of IMWP, they need scientific knowledge as well as suitable entrepreneurial scientists, that have expert multidisciplinary knowledge and strong understanding of integrated photonics (as it is KET in the EU), optoelectronics, industrial processes, automation and circuit design and layout, InP software simulation and modelling and a broad academic and industrial network.
In terms of training, the participants, as individual academic institutions as well as members of the MWP4SPACE network, will deliver the Doctoral Candidates or DCs’ with an excellent foundation for their future career through integrated training far beyond what would be possible through work at any single institution. Besides, the MWP4SPACE project will develop a framework for structuring doctoral training at the European level between excellent participants from academic and non-academic sectors as well as having a significant impact on structuring the doctoral research training capacity of the partners.
Concerning DCs careers, during the project MWP4SPACE will build upon the existing active collaborations and establish new ones by bringing the collaborating groups together, through secondments and networking events. After the project the MWP4SPACE network will aim to sustain itself after the project both for research collaboration and for long lasting, future training of interdisciplinary young researchers and PhD students.
In this first reporting period several objectives of the project have been addressed as described below.
- A model has been created to simulate and design micro ring resonators. In addition, a first design has been submitted for fabrication in SiNx technology. This model will be used to define the parameters required to generate Kerr combs such as the required power, and wavelength detuning.
- A first design of a beam steering chip has been designed and submitted for fabrication.
- A two-tone transceiver for satellite systems has been designed. The design has been submitted for fabrication in InP technology. During next months, after receiving the fabricated design, the transceiver will be tested and verified the performance against original specifications.
- A simulation of photonic AD converters based on highly stable frequency combs has been done, before submitting a design for fabrication in SOI technology
- A simulation of photonic integrated 90º Hybrid receivers for satellite application has been done. It is being implemented in the Lumerical Interconnect software, before submitting a design for fabrication in LNOI technology.
- A simulation of different implementations of OEO converters based on microring resonators has been performed
- The packaging, certification and space compliance of the packaged chips have to be carefully addressed. Currently, it is under desing a spot-size converter on LNOI technology which will be implemented in a fabrication run
- In this reporting period it is being designed a LNOI chip that can perform many different modulation formats at high bandwidths for satellite communications. This design will be submitted for fabrication in the year 2025.
- In this reporting period certification tests of several PICs for space applications have been done too. Currently, he is is assisting a PDK for an LNOI technology to be developed at the MWP4SPACE partner Camgraphics is being set up.
- DC14 is designing a low-noise transimpedance amplifier (TIA) on GaAs technology that will be used in a single-photon detector. His design will be submitted for fabrication in the month of January 2025.
- In this reporting period DC15 has carried out characterizations of narrow linewidth lasers that consist of an InP gain chip where the light is hybrid coupled to a Silicon-Nitride chip with a narrow wavelength filter. In addition, he has designed the next generation of this narrow linewidth laser and submitted the design for fabrication. Besides, he has published an article and submitted two conference presentations.
Apart from these technical objectives, three Training Schools with Scientific and Transferable Skills have been given. Extra trainings with online Nature Research modules are open for DCs participating in the program. This completes the training needed for all DCs. Those that entered into the program with delays, will receive these Training Schools during April 2025.
Finally, regarding communication and dissemination, web site, LinkedIn account and different videos have been published. Seven conference presentations have been prepared too.
- A model has been created to simulate and design micro ring resonators. In addition, a first design has been submitted for fabrication in SiNx technology. This model will be used to define the parameters required to generate Kerr combs such as the required power, and wavelength detuning.
- A first design of a beam steering chip has been designed and submitted for fabrication.
- A two-tone transceiver for satellite systems has been designed. The design has been submitted for fabrication in InP technology. During next months, after receiving the fabricated design, the transceiver will be tested and verified the performance against original specifications.
- A simulation of photonic AD converters based on highly stable frequency combs has been done, before submitting a design for fabrication in SOI technology
- A simulation of photonic integrated 90º Hybrid receivers for satellite application has been done. It is being implemented in the Lumerical Interconnect software, before submitting a design for fabrication in LNOI technology.
- A simulation of different implementations of OEO converters based on microring resonators has been performed
- The packaging, certification and space compliance of the packaged chips have to be carefully addressed. Currently, it is under desing a spot-size converter on LNOI technology which will be implemented in a fabrication run
- In this reporting period it is being designed a LNOI chip that can perform many different modulation formats at high bandwidths for satellite communications. This design will be submitted for fabrication in the year 2025.
- In this reporting period certification tests of several PICs for space applications have been done too. Currently, he is is assisting a PDK for an LNOI technology to be developed at the MWP4SPACE partner Camgraphics is being set up.
- DC14 is designing a low-noise transimpedance amplifier (TIA) on GaAs technology that will be used in a single-photon detector. His design will be submitted for fabrication in the month of January 2025.
- In this reporting period DC15 has carried out characterizations of narrow linewidth lasers that consist of an InP gain chip where the light is hybrid coupled to a Silicon-Nitride chip with a narrow wavelength filter. In addition, he has designed the next generation of this narrow linewidth laser and submitted the design for fabrication. Besides, he has published an article and submitted two conference presentations.
Apart from these technical objectives, three Training Schools with Scientific and Transferable Skills have been given. Extra trainings with online Nature Research modules are open for DCs participating in the program. This completes the training needed for all DCs. Those that entered into the program with delays, will receive these Training Schools during April 2025.
Finally, regarding communication and dissemination, web site, LinkedIn account and different videos have been published. Seven conference presentations have been prepared too.
For the current period, each technical Work Package has its own advances over the state of the art. Right now we foresee the following potential impacts beyond the technique:
- Microwave Systems for Space Communications and Sensing
• Simulation models of the main microwave systems for space
• Assemble novel MWP systems for space through the use of discrete and integrated MWP circuits.
• Test MWP systems to determine the main performance.
• Demonstrate the potential of the MWP solutions though the comparison with performance of standard RF solutions.
- Microwave Photonics: Devices and Circuits
• State of the art of photonic devices for MWP system design
• Simulation models of MWP devices
• To fabricate novel MWP devices and circuits for communication and sensing
• IMWP devices and circuits tested to determine operating characteristics.
• To demonstrate the performance of devices and circuits
- Microwave Electronics: Drivers, Amplifiers, and TIAs
• Research key electronics technologies required for space MWP;
• Investigate radiation-hardening by design (RHBD) in CMOS/SiGe BiCMOS;
• Identify innovative architectures
• Identify the interfaces required for the electronic-photonic co-integration;
• Develop proof-of-concept prototype and implement key microwave electronic integrated circuits.
- Space Compliant-Packaging and usability of microwave system
• Package research and specification for RF photonics and space environment for the different photonics technologies
• Package Designs for high frequency electrical interconnect in either hermetic or non-hermetic solutions
• PIC and electronics Package assembly and test plans towards qualification.
- Microwave Systems for Space Communications and Sensing
• Simulation models of the main microwave systems for space
• Assemble novel MWP systems for space through the use of discrete and integrated MWP circuits.
• Test MWP systems to determine the main performance.
• Demonstrate the potential of the MWP solutions though the comparison with performance of standard RF solutions.
- Microwave Photonics: Devices and Circuits
• State of the art of photonic devices for MWP system design
• Simulation models of MWP devices
• To fabricate novel MWP devices and circuits for communication and sensing
• IMWP devices and circuits tested to determine operating characteristics.
• To demonstrate the performance of devices and circuits
- Microwave Electronics: Drivers, Amplifiers, and TIAs
• Research key electronics technologies required for space MWP;
• Investigate radiation-hardening by design (RHBD) in CMOS/SiGe BiCMOS;
• Identify innovative architectures
• Identify the interfaces required for the electronic-photonic co-integration;
• Develop proof-of-concept prototype and implement key microwave electronic integrated circuits.
- Space Compliant-Packaging and usability of microwave system
• Package research and specification for RF photonics and space environment for the different photonics technologies
• Package Designs for high frequency electrical interconnect in either hermetic or non-hermetic solutions
• PIC and electronics Package assembly and test plans towards qualification.