The demand for massively increased wireless data capacity and ultra reliable low latency connectivity is driving the evolution toward sixth generation (6G) mobile communications. Millimeter wave (mm wave) frequencies—particularly the 151.5–164 GHz band—offer vast amounts of under utilized spectrum capable of multi Gb/s data rates. However, at these high frequencies, antenna systems must overcome severe path loss, limited antenna gain, tight integration constraints, and the need for full space coverage in mobile scenarios. Compact, low cost, highly steerable and wide band antenna arrays are therefore critical enablers for 6G handsets, access points, and eventual network densification.
The project set out to develop a novel radiating element and array topology tailored to the 151.5–164 GHz band, integrated in a chip scale or package scale form factor. Its objectives were to (1) design and validate a single, wide band radiating element with omnidirectional like coverage; (2) assemble a beam steering subarray capable of electronic scanning over ±70°; (3) fabricate and characterize a proof of concept prototype demonstrating both gain and coverage targets; and (4) extend the design to dual polarized operation while maintaining compactness and performance. Through these steps, the project aimed to bridge the gap between mm wave physics, practical antenna on chip manufacturing, and the needs of real world mobile applications.
By achieving these objectives, the project contributes to Europe’s strategic digital goals—supporting “Europe for the digital age” and the rollout of next generation networks—while advancing the scientific state of the art in ultra high frequency antenna integration. The innovations promise to unlock new use cases in immersive multimedia, ultra secure critical links, and distributed sensing, with significant implications for both consumer devices and industrial Internet of Things platforms.
