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Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment

Project description

Expanding European FDSOI tech for semiconductor supply autonomy

The European FDSOI technology platform is recognised for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories, and exceptional radio frequency capabilities. The EU-funded SOIL project aims to expand the use of FDSOI technology within the European industry, providing an alternative to enhance semiconductor supply autonomy. The project will accelerate semiconductor manufacturing using FDSOI technology and develop advanced features for the next generation of FDSOI technologies and components. It will strengthen the FDSOI design ecosystem and supply chain, as well as improve digital, analogue, and RF single-chip integration capabilities. Ultimately, SOIL seeks to demonstrate the technology’s capabilities and benefits through advanced demonstrators in the fields of automotive, space, and communications, along with benchmark comparisons.

Objective

The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories and exceptional radio frequency capabilities. The objective of the SOIL project is to extend FDSOI technology platforms and broaden their use within the European industry in order to provide Europe with a real alternative to semiconductor supply autonomy using FDSOI semiconductors.

We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market.
The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe.

The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition.

SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas:

i) Advanced features: prepare next generation of FDSOI technologies and components;

ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing;

iii) Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar).

The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology.

SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.

Fields of science (EuroSciVoc)

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Coordinator

STMICROELECTRONICS CROLLES 2 SAS
Net EU contribution
€ 1 520 696,00
Address
RUE JEAN MONNET 850
38920 Crolles
France

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Region
Auvergne-Rhône-Alpes Rhône-Alpes Isère
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost
€ 7 603 481,25

Participants (34)

Partners (2)