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New High Heat Conducting Materials and Manufacturing Processes for Improved Efficiency of Heat Management and Packaging Components in Electronics

Objective

The project HeatConductives is focused on the improvement of efficiency and reliability of electronic systems by the use of new high heat conducting materials and products formed by the combination of Cu and new vapour grown carbon nanofibres (VGCFs) and nanotubes (CNTs) of outstanding thermal conductivity. Conventional and innovative manufacturing processes will be developed along the project to produce thin foils and 3D near net shape components. HeatConductives specifically addresses the requirement for a new low cost and easy to process material for the industrial requirement of adaptive heat-sinks to assist thermal management. This is an urgent problem, especially for new semiconductors (GaAs or GaN), needing better heat control to get their full potentiality. Heat management critically affects the electronics, microelectronics, telecomm, automotive and avionics industries, impacting speed, size, weight and reliability. This is especially critical for future components managing electric currents and packaging densities orders of magnitude higher than now. A new economically viable material is necessary to solve this problem and enable components with the highest performances. So, the HeatConductives project will develop a generic solution suitable for use across a wide range of European Industry serving the high thermal performance and reliability markets. The project target is to develop a heat-sink material with the advantages:
-Reduced cost and increased heat conductivity than state of the art materials
-Low and tailored CTE
-Manufactured by high yield industrial processes (Tape Casting; Metal Injection Moulding)
-Easy machinability, The following partial objectives are summarised:-Development of heat conductive VGCNFs and CNTs. -Production of feedstock for MIM and TC with Cu and C. -Development manufacturing processes for MMCs

Call for proposal

FP6-2003-SME-1
See other projects for this call

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Coordinator

FUNDACION INASMET
Address
Paseo Mikeletegi 2, Parque Tecnologico Miramon
San Sebastian
Spain

Participants (8)

ADVANCED COMMUNICATION RESEARCH & DEVELOPMENT, S.A.
Spain
Address
C/calvo Sotelo 23, 2 Izq
Santander
ALLIANCE
France
Address
Z.a.b.o.
Saint-vit
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS)
France
Address
3, Rue Michel-ange
Paris
ESVRES MATRIÇAGE SAS
France
Address
Route De Cormery
Esvres
GRUPO ANTOLIN-INGENIERIA S.A.
Spain
Address
Carretera Madrid-irun Km 244,8
Burgos
IMT SRL
Italy
Address
Via Cipriano Facchinetti, 67
Roma
MARION TECHNOLOGIES S.A.
France
Address
Cap Delta - Parc Technologique Delta Sud
Verniolle
SEMELAB PLC
United Kingdom
Address
Coventry Road
Lutterworth