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Application, refinement and consolidation of HIC, exploiting standards

Objective



The OMI/HIC (ESPRIT 7252) project successfully developed a range of interconnect technologies, and established them as an international standard (ISO/IEC 14575CD, also known as IEEE 1355). The Macramé project (ESPRIT 8603) is focusing on the support for static networks constructed from IEEE 1355 compliant interconnect. Building on these results, products at both silicon and system levels have already been introduced into the marketplace from a number of suppliers, and several proposals are now being submitted which exploit the HIC technology in specific applications. However, to ensure the wide take-up of the HIC technology, it is paramount that customers are given the confidence that the technology will continue to be developed and supported.
Major potential markets exist for IEEE 1355 to be used in building networks for existing and emerging communications standards. Addressing these markets requires support of networks where the network configuration, topology and bandwidth assignment will change dynamically.
This project therefore aims to expand the range of applications for the OMI/HIC interconnect technology by

- further developing both component and network technology, and optimising and refining existing HIC technology and software tools in response to new market requirements (faster links, cheaper links, support for dynamic networks, fault tolerance);
- developing and promoting the interworking of IEEE 1355 interconnect standards with interfacing and communication standards such as PCI, SCI, ATM, Fibre Channel, Token Ring and Ethernet;
- proving and demonstrating HIC technology on a large scale test-bed and in applications demonstrators, feeding back information to the technology providers and feeding forward exploitation experience to potential users;
- providing a forum through which it will directly involve the customers and potential customers of the HIC technology in order to guide further component development, to facilitate the exchange of information between the applications projects and the technology providers, and to maximise the effectiveness of the applications development.
As well as the demonstrators and applications, which will be exploited by the user partners in their products, the project will produce macrocells (which will be exploited in standard products and in ASIC libraries and will be licensed to third parties), algorithms for dynamic network support (which will be incorporated into appropriate international standards) and toolset software, which will be used to provide requirements input for product developments.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

Parsytec Computer Gmbh
Address
Roermonder Strasse 197
52072 Aachen
Germany

Participants (7)

Bull Sa
France
Address
Route De Versailles 68
78430 Louveciennes
Cern - Laboratoire Europeen Pour la Physique des Particules
Switzerland
Address
Route De Meyrin
1211 Geneve 23
Dolphin Server Technology As
Norway
Address
Olaf Helsets Vei, Bogerud
0621 Oslo
Netwiz
Israel
Address
Advance Industrial Park
20692 Yokneam
SINTEF
Norway
Address
Forskningsveien 1
0314 Oslo
Stmicroelectronics Limited
United Kingdom
Address
Planar House, Parkway, Globe Park,
SL7 1YL Marlow,
UNIVERSITE PIERRE ET MARIE CURIE - PARIS VI
France
Address
Place Jussieu 4
75252 Paris