- assessment of the capabilities of a newly developed deep-UV stepper from ASM-L (PAS 500/300) for the volume production of 0,25 micron CMOS integrated circuits;
- evaluation of the stability of key lithographic parameters, such as, resolution, depth of focus, exposure latitude and proximity effects;
- study of lens heating effects;
- comparative study of the image sensor focus monitoring technique with alternative techniques;
- in-depth study of reliability issues such as mean time between failure (MTBF), mean time to repair (MTTR), mean time between incident (MTBI);
- analysis of cost of ownership in comparison with i-line steppers, taking into account capital investment, environmental issues, operational cost, material consumption and total installed wafer capacity;
- definition of updated specifications for future deep-UV steppers;
- initial evaluation of the PAS 500/300 performance for 0,18 micron CMOS technologies.
The overall goal of this SEA project is to perform an in-depth assessment of the ASM-L PAS 500/300 deep-UV Wafer stepper for the volume production of 0,25 micron CMOS devices and to explore its potential for 0,18 micron geometries. The assessment site is at IMEC, while industrial users from Europe, the USA, Korea and Taiwan will be involved in the assessment. The project should result in the definition of industrial specifications for future deep-UV steppers, thereby strengthening the world-wide market position of the European equipment maker involved.