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Network in microelectronic system integration technologies-packaging

Objective

Identify packaging activities in Central and Eastern European countries and potential areas for cooperation.
Presentation and publication of "European Packaging" journal.
Contribute to the conception of European R&D programmes.
Develop technology roadmaps for different packaging applications.
Establish a packaging communication electronic network.
Present status and future evolution of CSP (Chip Scale Packages).
Establish links with Known-Good-Die action and Europractice-MCM.
Organise NETPACK sessions in conjunction with major events on Packaging and Interconnection.

Packaging and interconnection technology is essential for the realisation and manufacturing of all electronic equipment. It also determines to a large degree the overall system engineering approach which is adopted, including design, assembly and test. During the last few years packaging and interconnection has received growing attention from the industry as a way to achieve system integration: The spectrum of existing technological approaches is becoming broader with the incorporation of emerging types of construction and innovative combinations of materials and processes.
To make the best use of the capabilities of assembly technologies, system manufacturers need to have access to - and master - a variety of technological routes. In all cases a thorough understanding of the available techniques, their strengths and weaknesses, their impact on performance and reliability, and very particularly the associated cost aspects are essential from the component, subsystem and system producers to succeed in world markets.

Funding Scheme

ACM - Preparatory, accompanying and support measures
Leaflet | Map data © OpenStreetMap contributors, Credit: EC-GISCO, © EuroGeographics for the administrative boundaries

Coordinator

Fraunhofer Gesellschaft Zur Forderung der Angewandten Forschung Ev Zentralverwaltung
Address
Leonrodstrasse 54
80636 Munchen
Germany