Objective - To make available MCM technologies for automotive subsystems in order to solve the integration problem common to future electronics automotive systems with cost efficiency.- To transfer the results of the programme into production on a short time-scale.- To open Known Good Die availability in a flip chip configuration.A low cost existing MCM technology, based on laminated substrate (MCM-L) has been developed for telecom and computer applications. The main content of the work will consist in adapting this technology to meet automotive harsh environment requirements. The packaging and assembly techniques will be exploited to the high volumes series.Other topics addressed in this project include reliability, testability, modelling (thermomechanical and power dissipation) and implementation of a KGD technology for automotive cost and reliability requirements. Integration of passive components and MCM compatibility with insulated Metallic Substrate (Automotive Mother Board Substrate) are critical issues which are also addressed by AUDICO. The demonstration of this approach will be achieved by realising the digital core of an Electronic Control Unit including microprocessor, associated memory and the interface circuit. Fields of science engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringcomputer hardwarecomputer processors Programme(s) FP4-ESPRIT 4 - Specific research and technological development programme in the field of information technologies, 1994-1998 Topic(s) 2.3 - Semiconductors - Microelectronics for product innovation Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator Societe D'applications Generales D'electricite et de Mecanique S.A. Address Le ponant de paris rue leblanc 27 75512 Paris France See on map EU contribution € 0,00 Participants (4) Sort alphabetically Sort by EU Contribution Expand all Collapse all Bull Sa France EU contribution € 0,00 Address Route de versailles 68 78430 Louveciennes See on map Motorola Germany EU contribution € 0,00 Address Schatzbogen 7 81829 Munchen See on map Rover Group plc United Kingdom EU contribution € 0,00 Address International house bickenhill B37 7HQ Birmingham See on map Technische Universitat Berlin - der President Germany EU contribution € 0,00 Address Strasse des 17 juni 135 10623 Berlin See on map
