Objective
Components: Usage of flip chip with pitch down to 150 um or with redistributed pitch down to 250 um as well as Chip Scale or Chip Size Packages (CSP), peripheral pitch down to 200 um or grid array pitch down to 300 um.
First level interconnect: Mounting onto filled and tented vias. Reflow soldering for fine pitch flip chip, combined with underfill. Flip chip and SMD on flexible substrates combined using adhesive technology.
Substrates: Fine line multilayer substrates with lines and spacing down to 50 um, both in rigid and flex form with via in pad technology realised by photo imaging or laser drilling.
Second level interconnect: Interconnect to the outer world, through a moulded injection device ( MID).
The Multi-Chip Module (MCM) technology will be made more attractive for use in communications, automotive, industrial and consumer electronics applications.
This will be realised by the development of a highly miniaturised and low overall cost MCM technology. It comprises innovative and low cost production processes at all levels- components, first level interconnect, substrates, second level interconnect- of the MCM architecture. The goals can be achieved through :
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
5600 MD Eindhoven
Netherlands
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.