Objective
Components: Usage of flip chip with pitch down to 150 um or with redistributed pitch down to 250 um as well as Chip Scale or Chip Size Packages (CSP), peripheral pitch down to 200 um or grid array pitch down to 300 um.
First level interconnect: Mounting onto filled and tented vias. Reflow soldering for fine pitch flip chip, combined with underfill. Flip chip and SMD on flexible substrates combined using adhesive technology.
Substrates: Fine line multilayer substrates with lines and spacing down to 50 um, both in rigid and flex form with via in pad technology realised by photo imaging or laser drilling.
Second level interconnect: Interconnect to the outer world, through a moulded injection device ( MID).
The Multi-Chip Module (MCM) technology will be made more attractive for use in communications, automotive, industrial and consumer electronics applications.
This will be realised by the development of a highly miniaturised and low overall cost MCM technology. It comprises innovative and low cost production processes at all levels- components, first level interconnect, substrates, second level interconnect- of the MCM architecture. The goals can be achieved through :
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
You need to log in or register to use this function
Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
5600 MD Eindhoven
Netherlands