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Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly

Objective

FAB2ASM tackles a major problem in 3D integration that currently limits industrial take-up: high throughput and high accuracy 3D integration of miniaturized dies onto dies or substrates. This issue is extremely important for 3D integration of microelectronics and microsystems. 3D integration will take off in the next 5 years in all measures including total number of devices, the market share, as well as the density of the connections. The state-of-the-art integration technology for 3D microsystems relies on robotic pick-and-placing machines and machine vision, which cannot achieve simultaneously high-speed and high-precision. If high precision e.g. a micron is needed, either the cycle time of integration can be very long, from e.g. over ten seconds to minutes, or even not achievable. The objective of the FAB2ASM is to develop highly efficient and precise die-level component integration technology based on hybrid assembly technology that joins robotic tools and self-alignment and corresponding interfacing methods for multi-functional microsystems. In contrast to most explorative self-assembly technology developed to-date, FAB2ASM attempts to develop a highly industry relevant technology that reuses most of the industrial process steps, but on the other hand dramatically improves the performance of the integration process in the precision and efficiency chart. FAB2ASM will allow handling small (100 µm) and/or thin dies (20 µm), ultra high speed assembly (40,000 UPH), and flip-chip capabilities, while ensuring industry proven reliability. Led by AALTO, this consortium of 5 research centers and 4 industries (ST, NXP, BX, 3DPLUS) will join force to fulfil this urgent and important need of industry in 3D integration, and will demonstrate the merits in three industry led demonstrators: one manufacturing equipment demonstrator, one photonic IC demonstrator and 3D microelectronics demonstrator.

Field of science

  • /social sciences/economics and business/business and management/commerce
  • /natural sciences/physical sciences/electromagnetism and electronics/microelectronics

Call for proposal

FP7-2010-NMP-ICT-FoF
See other projects for this call

Funding Scheme

CP - Collaborative project (generic)

Coordinator

AALTO KORKEAKOULUSAATIO SR
Address
Otakaari 1
02150 Espoo
Finland
Activity type
Higher or Secondary Education Establishments
EU contribution
€ 847 537,08
Administrative Contact
Quan Zhou (Dr.)

Participants (9)

UNIVERSITE DE FRANCHE-COMTE
France
EU contribution
€ 468 228,20
Address
1 Rue Claude Goudimel
25000 Besancon
Activity type
Higher or Secondary Education Establishments
Administrative Contact
Pauline Fournier (Ms.)
EIDGENOSSISCHE MATERIALPRUFUNGS- UND FORSCHUNGSANSTALT
Switzerland
EU contribution
€ 488 300
Address
Ueberlandstrasse 129
8600 Dubendorf
Activity type
Higher or Secondary Education Establishments
Administrative Contact
Johann Michler (Dr.)
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium
EU contribution
€ 910 304,05
Address
Kapeldreef 75
3001 Leuven
Activity type
Research Organisations
Administrative Contact
Christine Van Houtven (Ms.)
UNIVERSITEIT TWENTE
Netherlands
EU contribution
€ 472 097,25
Address
Drienerlolaan 5
7522 NB Enschede
Activity type
Higher or Secondary Education Establishments
Administrative Contact
Albertus Huis In 't Veld (Prof.)
STMICROELECTRONICS SRL

Participation ended

Italy
EU contribution
€ 23 991,62
Address
Via C.olivetti 2
20864 Agrate Brianza
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Cristina Di Gesù (Dr.)
NXP SEMICONDUCTORS NETHERLANDS BV
Netherlands
EU contribution
€ 764 440
Address
High Tech Campus 60
5656AG Eindhoven
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Amanda Raats (Ms.)
Beam Express S.A.
Switzerland
EU contribution
€ 430 617,80
Address
Parc Scientifique Epfl Batiment C
1015 Lausanne
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Jean-Claude Charlier (Mr.)
AYMING
France
EU contribution
€ 169 420
Address
185 Avenue Des Gresillons
92622 Gennevilliers Cedex
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Emmanuelle Bur (Mrs.)
3D PLUS SA
France
EU contribution
€ 158 664
Address
Rue Helene Boucher Zi 408
78530 Buc
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Christian Val (Mr.)