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Generic Technologies for WDM Transmitter Photonic
Integrated Circuits

Objective

The project aims at achieving the improvement of Photonic Integrated Circuit (PIC) building blocks (BBs) for generic integration technology, the design and fabrication of high bit-rate transmitter PICs, typically WDM 10x 25Gbps and 4x 25GBau Tx PIC as test vehicles for the deve-loped BBs, and finally the test and validation of the fabricated PICs in a transmission environment. The program addresses a significant step beyond the present state-of-the-art.
To achieve these goals, both partners have adequate infrastructure and complementary means. Some challenging milestones will be set to be reached, such as deep UV stepper lithography; assessment of semi-insulating (SI)-substrate based technology; SAG (Selective Area Growth) epitaxy techniques; SiBH (Semi-Insulating Buried Hetero-structure); advanced RF (radio-frequency) circuit engineering. The test vehicles will be validated in transmission systems, and potential markets for the developed PICs will be explored.

Call for proposal

FP7-PEOPLE-2012-ITN
See other projects for this call

Funding Scheme

MC-ITN - Networks for Initial Training (ITN)

Coordinator

III-V LAB
Address
1 Avenue Augustin Fresnel Campus Polytechnique
91767 Palaiseau Cedex
France
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
EU contribution
€ 63 211,48
Administrative Contact
Denis Mazerolle (Dr.)

Participants (1)

TECHNISCHE UNIVERSITEIT EINDHOVEN
Netherlands
EU contribution
€ 655 106,98
Address
Groene Loper 3
5612 AE Eindhoven
Activity type
Higher or Secondary Education Establishments
Administrative Contact
Suzanne Udo (Ms.)