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Multi-component oxides for flexible and transparent electronics

Objective

Added value features associated with high performance transparent displays have the potential to catapult the electronics industry into a new era of growth. Features such as transparency and flexability promise the emergence of a plethora of new application spaces in sectors ranging from the automotive to computer based industries, where applications will be based on the discreetness of the devices as much as the electronic functionality. The flexible nature of devices will have impact on both the device application space and also on the manufacturing of flexible electronics.

The use of flexible plastic substrates will facilitate a migration away from fab based batch processing to large area, roll to roll manufacturing technology which is perceived as offering a significant advantage in terms of reduced cost with increased throughput due to fewer manufacturing steps and as such will have tremendous industrial impact. There are significant challenges to overcome in order to enable the vision of low cost, environment ally friendly manufacturing and to achieve high performance electronic devices with the required mechanical and optical attributes.

The technology barriers to be overcome include: the development of radically new materials which can offer the electronic, mechanical and optical properties required: the development of novel deposition techniques which enable low temperature, large area processing on flexible substrates: the development of non-fab based low temperature patterning techniques on flexible substrates. The MULTIFLEXOXIDES project aims to address these materials and processing challenges so as to retain Europe's status at the forefront of flexible electronics, developing so radically new ceramic thin films,(amorphous or nano-structured) which can be utilise d as flexible and transparent conducting, semi-conducting and insulating device components. Their inorganic nature should result in environmentally stable and long lifetime devices and systems.

Call for proposal

FP6-2004-NMP-TI-4
See other projects for this call

Funding Scheme

STREP - Specific Targeted Research Project

Coordinator

UNINOVA - INSTITUTO DE DESENVOLVIMENTO DE NOVAS TECNOLOGIAS
Address
Campus Da Fct/unl, Quinta Da Torre
Caparica
Portugal

Participants (6)

CENTRO RICERCHE FIAT SOCIETA CONSORTILE PER AZIONI
Italy
Address
Strada Torino 50
10043 Orbassano (To)
HEWLETT PACKARD (MANUFACTURING) LIMITED
Ireland
Address
Liffey Park Tech Campus, Barnhall Road
Leixlip Co Kildare
INSTITUT JOZEF STEFAN
Slovenia
Address
Jamova 39
Ljubljana
UNIVERSIDADE NOVA DE LISBOA
Portugal
Address
Campus De Campolide
Lisboa
UNIVERSITAT DE BARCELONA
Spain
Address
Gran Via De Les Corts Catalanes 585
Barcelona
UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland
Address
College Road
Cork