Objectif The growing complexity of mobile communication and wireless devices has resulted in a growing and important requirement for low cost, low consumption and reduced size microelectronic and microsystem components in these products. This requires a high level of integration and poses significant challenges at all technology steps from materials through processing to packaging. The goal of CAMELIA (Monolithic Above IC Ultra High Value Capacitors for Mobile and Wireless Communication Systems) is to respond to this technology integration challenge in the specific area of capacitor technology. This is a critical area for future product innovation within the Information and Communications Technologies sector. For example, in a mobile phone, 80% of the surface is devoted to single passive components and especially capacitors.The main targeted application of CAMELIA is on-chip capacitors. By fabricating thin-film capacitors on-chip, one gains not only high-frequency decoupling capacitors, but also space saving, and significant improvements in performance over discrete chip capacitors. CAMELIA addresses the above challenge of manufacturing a thin film, high capacitance, above chip (hence low temperature) capacitor component by developing a novel low-cost ferroelectric multi-component oxide based materials science and processing technology, enabling the integration of decoupling capacitors with a very small form factor in an above-IC strategy for System on Chip and wireless microsystems.The overall aim of CAMELIA is to research and develop a novel low temperature (#lt;400oC) high k (above 2000) dielectric material and processing technology for future high density or ultra low profile MIM (Metal/Insulator/Metal) decoupling capacitor applications. To the best of our knowledge, this has not been demonstrated to-date. Champ scientifique ingénierie et technologienanotechnologienanomatériauxnanocristalingénierie et technologieingénierie des materiauxrevêtement et filmsingénierie et technologiegénie électrique, génie électronique, génie de l’informationingénierie de l’informationtélécommunicationtéléphone mobileingénierie et technologiegénie électrique, génie électronique, génie de l’informationingénierie de l’informationtélécommunicationtechnologie radioingénierie et technologieingénierie des materiauxcéramique Programme(s) FP6-NMP - Nanotechnologies and nanosciences, knowledge-based multifunctional materials and new production processes and devices: thematic priority 3 under the 'Focusing and integrating community research' of the 'Integrating and strengthening the European Research Area' specific programme 2002-2006. Thème(s) NMP-2004-3.4.2.2-3 - Multifunctional ceramic thin films with radically new properties Appel à propositions FP6-2004-NMP-TI-4 Voir d’autres projets de cet appel Régime de financement STREP - Specific Targeted Research Project Coordinateur UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK Adresse College road, Cork Irlande Voir sur la carte Liens Site web Opens in new window Contribution de l’UE Aucune donnée Participants (4) Trier par ordre alphabétique Trier par contribution de l’UE Tout développer Tout réduire 3D PLUS France Contribution de l’UE € 0,00 Adresse 641 rue helene boucher Buc Voir sur la carte Liens Site web Opens in new window Autres sources de financement Aucune donnée COMMISSARIAT A L' ENERGIE ATOMIQUE' France Contribution de l’UE € 0,00 Adresse 31-33 rue de la federation Paris Voir sur la carte Liens Site web Opens in new window Autres sources de financement Aucune donnée ELA MEDICAL SAS France Contribution de l’UE € 0,00 Adresse 98 - 100 rue maurice arnoux Montrouge Voir sur la carte Liens Site web Opens in new window Autres sources de financement Aucune donnée INSTITUT JOZEF STEFAN Slovénie Contribution de l’UE € 0,00 Adresse Jamova 39 Ljubljana Voir sur la carte Liens Site web Opens in new window Autres sources de financement Aucune donnée
