Final Report Summary - LEADOUT (Low cost lead-free soldering technology to improve competitiveness of European SME) The LEADOUT project aimed to help small and medium enterprises (SMEs) in the European electronic industry to implement lead-free soldering technology in compliance with the relevant European Directives in order to increase the process yields in the assembly of printed circuit boards (PCBs) and render SMEs more competitive in the open market. The project provided technical support to problems arising from the replacement of materials and increased SMEs awareness over the required change magnitude. In addition, process quality standards were established so as to rapidly convert to lead-free soldering, reduce defect rates and maximise products' reliability. Finally, LEADOUT improved health and safety awareness and pollution prevention. Feedback from the industry was received throughout the adoption of technological proposals, the compliance with environmental requirements and the implementation of training schemes. An innovative monitoring and analysis process was applied for this purpose. A series of nine commercial products was built by the involved SMEs for soldering trials, including five different lead-free alloys, all of the main circuit board plated finishes and several component types. Moreover, numerous assembly process methodologies were developed. An electronic image database was designed to help potential users identify likely differences between the joint materials. Material and processing data for the solder joints were also recorded, to allow for searching specific factors' combinations. The reliability of lead-free soldered assemblies was examined by virtual assessment, accelerated testing and cross-sectional analysis. No significant difference was noted between the performance of conventional and lead-free solder alloys for surface mount joints. In addition, the proposed solders performed better than existing materials in cases of through-hole joints. All examined alternative alloys performed similarly during the testing procedure. The cross-sectional microstructural evaluations were also promising, despite the significant surface degradation that was observed. % Furthermore, an environmental assessment was performed to quantify the impact of lead-free solders in comparison to existing alternatives. The study included: 1. emission measurements and analysis of fumes; 2. leaching tests of soldered printed circuits and wave dross; 3. life-cycle assessment (LCA) for industrial soldering processes; and 4. sampling at working areas to obtain occupational exposure measurements. The LCA study recommended an increase in use of recycled material to mitigate the severe effects that were related to tin mining. On the other hand, the proposed innovations were beneficial in terms of emissions to air, soil and water. Moreover, the elimination of lead was advantageous for workers' health, since the material had cumulative impact on human organisms. The implemented plan for knowledge exploitation and dissemination included protection of intellectual property, licensing arrangements and exploitation restrictions. The selected dissemination mechanisms consisted of meetings, seminars, trade fairs, workshops and construction and update of the project website, which served as an information resource and as a measure of the success of LEADOUT promotion. Training courses, either conventional on through the internet, were also organised to supply engineers and operators with information on PCB manufacturing with an emphasis on lead-free technology. Finally, collaboration with similar European research projects was established. Related documents Final Report - LEADOUT (Low cost lead-free soldering technology to improve competitiveness of European SME)
