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The application of polymer electronics towards ambient intelligence

Objective

Things that think and the communication of people with such things in his environment critically depend on contactless communication technologies. RF communication devices and protocols have been developed in the past and exist today, yet in their present form they cannot and will never be used on a large scale to allow communication with everyday objects.

The fundamental reason for this is the cost of the silicon technology employed to realize it. Even in its most optimistic projection, this cost remains at least one order of magnitude higher than the cost of a technology that has been proven to be truly ubiquitously applicable, such as a barcode. Therefore, a new generation of devices is required to enable ambient intelligence at the right cost point in order to be truly applicable everywhere and anywhere.

The objective of PolyApply is to lay the foundations of a scalable and ubiquitously applicable communication technology. The boundary condition is the cost of the microsystem, combining basic RF communication with sensor functions. The key to achieving a fundamentally different cost point than what will be reachable in the future with the evolution of the existing technologies (e.g. CMOS), is to resolutely move to adisruptive new manufacturing technology: going from batch processing to in-line manufacturing technology.

The semiconductor system envisaged to this end is based on polymers. The scalable aspect refers to the fact that PolyApply does not plan to propose a solution for a certain generation of RF communication devices useful at one point in time, but rather intends to develop generic technologies with a meaningful impact in the mid- and long term. In other words, the developed technologies will lead to an extendable family of products, ranging from "simple" RF tags at ultra-low cost to RF communication devices with complex functionality such as integrated re-writable memory, sensory inputs, display, etc…

Field of science

  • /natural sciences/chemical sciences/polymer science

Funding Scheme

IP - Integrated Project

Coordinator

STMICROELECTRONICS S.R.L.
Address
Via Olivetti 2
20041 Agrate Brianza
Italy

Participants (17)

CESKE VYSOKE UCENI TECHNICKE V PRAZE
Czechia
Address
Zikova 4
Praha 6
COMMISSARIAT A L'ENERGIE ATOMIQUE
France
Address
Batiment Le Ponant D, 25 Rue Leblanc
75015 Paris Cedex 15
EM MICROELECTRONIC-MARIN S.A.
Switzerland
Address
Rue Des Sors 3
2074 Marin-epagnier
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany
Address
Hansastrasse 27C
80686 Muenchen
HUECK FOLIEN GMBH
Austria
Address
Gewerbepark 30
4342 Baumgartenberg
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Belgium
Address
Kapeldreef 75
3001 Leuven
JOANNEUM RESEARCH FORSCHUNGSGESELLSCHAFT MBH
Austria
Address
Steyrergasse 17
8010 Graz
MERCK CHEMICALS LTD
United Kingdom
Address
Wilberforce Court, Alfred Gender Street
HU1 1UY Hull
MOTOROLA GMBH
Germany
Address
Heinrich-hertz-strasse 1
65232 Taunusstein
PHILIPS ELECTRONICS NEDERLAND B.V.
Netherlands
Address
Boschdijk 525
5621 JG Eindhoven
PLASTIC LOGIC LIMITED
United Kingdom
Address
34-35 Cambridge Science Park, Milton Road
CB4 OFX Cambridge
POLYIC GMBH & CO.KG
Germany
Address
Tucherstrasse 2
90763 Fuerth
TECHNISCHE UNIVERSITAET BRAUNSCHWEIG
Germany
Address
Pockelstrasse 14
38106 Braunschweig
TECHNISCHE UNIVERSITAET CHEMNITZ
Germany
Address
Strasse Der Nationen 62
09107 Chemnitz
UNIVERSITY OF LIVERPOOL
United Kingdom
Address
Brownlow Hill 765
L69 7ZX Liverpool
VDI/VDE INNOVATION + TECHNIK GMBH
Germany
Address
Steinplatz 1
10623 Berlin
ZEILER AG
Switzerland
Address
C/o Limmatdruck Ag, Pfadackerstrasse 10
8957 Spreitenbach