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Smart high-integration flex technologies

Objective

The objective of the project is the development of smart, high-integration, mechanically flexible electronic systems, for a wide variety of applications. "Smart" means that the flexible multi-layer laminate has embedded components, and that the different flex layers in the multi-layer structure can have different functions, meaning that it might be necessary to combine layers of different base material in the laminate. Compactness of the resulting circuit will be boosted in two ways: by using the third dimension for electronic component integration (not only on front and back side, but potentially on every conductive layer) and by drastically increasing the wiring density through the introduction of new flex manufacturing and lamination techniques.

Innovative technologies to be developed in SHIFT include: a new, cheap flex laminate technology, based on a process for electroless Cu deposition on polyimide. A new lamination technology, based on interconnection by solid-state diffusion. Component embedding technologies: resistors, capacitors, RF components and ultra thin (20 micron) chips. Assembly technologies on embedded multi-layer flex.

The rationale of the project is that in order to realise the "ambient intelligence" vision, more and more electronics systems will accompany the citizen. For these systems there is a trend towards increased functionality, compactness, wearibility and reduced weight. The system may not hamper the mobility of the human carrier. Flexible electronics systems take the shape of the object onto or into which they are placed and may become quasi non-noticeable to the user.

Compared to their rigid board counterparts they show a drastic increase of comfort for the user, and therefore the trend is starting and will become only stronger towards the use of "smart" comfortable mechanically flexible electronic systems. The aim of SHIFT is precisely to develop enabling technologies for such complex flexible electronic systems.

Funding Scheme

IP - Integrated Project

Coordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
Address
Kapeldreef 75
3001 Leuven
Belgium

Participants (10)

ACREO AB
Sweden
Address
Isafjordsgatan 22
164 40 Stockholm-kista
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany
Address
Hansastrasse 27C
80686 Muenchen
FREUDENBERG MEKTEC EUROPA GMBH
Germany
Address
Koepestrasse 4-6
41812 Erkelenz
HIGHTEC MC AG
Switzerland
Address
Fabrikstrasse
5600 Lenzburg
NOKIA OYJ
Finland
Address
Keilalahdentie 4
02150 Espoo
OTICON A/S
Denmark
Address
Kongebakken 9
Smorum
TECHNISCHE UNIVERSITAET BERLIN
Germany
Address
Strasse Des 17. Juni 135
Berlin
THALES SYSTEMES AEROPORTES S.A.
France
Address
2, Avenue Gay-lussac La Clef De Saint Pierre
78990 Elancourt
VDI/VDE INNOVATION + TECHNIK GMBH
Germany
Address
Steinplatz 1
Berlin
ZARLINK SEMICONDUCTOR LIMITED
United Kingdom
Address
Cheney Manor
SN2 2QW Swindon, Wiltshireswindon Wiltshire