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Yield Control in SMD Assembly

Objective

The aim of this action was to develop a specification for a yield improvement system for fine-pitch surface-mounted device (SMD) assembly, particularly in SMEs.
The aim of this action was to develop a specification for a yield improvement system for fine pitch surface mounted device (SMD) assembly, particularly in small and medium sized enterprises (SME). The consortium identified the state of the art and the definition of needs for fine pitch surface mount assembly (SMA) within SMEs. The particular problems of fine pitch SMA were studied, including soldering techniques, failure analysis and reliability evaluation. The testability of fine pitch assemblies was also assessed. The specification of the yield improvement system included designing the assembly for high yield, operator training and statistical process control.

Topic(s)

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Call for proposal

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Funding Scheme

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Coordinator

WELD-EQUIP
Address
Engelseweg, 164, 164
5700 AD Helmond
Netherlands

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Participants (3)

Consorzio per lo Sviluppo dell'Elettronica e l'Automazione
Italy
Address
Via Ventimiglia 201
10127 Torino

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UNIVERSITY COLLEGE CORK
Ireland
Address
Prospect Row
Cork

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VALTRONIC FRANCE SA
France
Address
Route De L'orme Des Merisiers
91195 Gif-sur-yvette

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