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Content archived on 2024-05-29

Lead-free joining for micro electronics and micro system technology devices

Final Report Summary - JOITEC (Lead-free joining for microelectronics and microsystem technology devices)

The ultimate aim of the JOITEC project was to establish a flexible and controlable laser welding process, the so-called laser spot welding which is expected to become the most widely used joining technology in the electronic industry. In this process, a laser beam with adapted wavelength is employed to enable the welding of spots smaller than 250 nm and avoid the use of lead-based materials. Within the framework of the JOITEC project, an online welding quality inspection system was developed to evaluate the correlation between welding-specific emissions and the weld quality.

Not only would this environmentally friendly technology be directly applicable into the production lines of the participating Small and medium-sized enterprises (SMEs), it would also allow SMEs to meet the European guidelines on European Waste from electrical and electronic equipment (WEEE) and Reduction of hazardous substances (ROHS).

The project succeeded in developing a laser spot welding machine prototype comprising a laser beam of 515 nm wavelength and a fibre optic beam guidance system, a work head, integrated inspection instruments and compatible software. It also designed Printed circuit boards (PCBs) in order to test and further enhance the laser spot welding process.