The objective of ALERT is to develop the equipment and process required to produce printed circuit boards with surface-mounted devices (SMD) and fine pitch IC (integrated circuit) components with high-speed laser-soldering techniques. Picking, placing and soldering will be combined in one process step.
The approach will be based on:
- vision feedback on placement, to obtain the accuracy necessary for laser soldering ("Look and place")
- beam deflection control based on a new closed-loop sensory control concept, to recognise laser spot position on the board and solder pad positions simultaneously
- a new ultrasound sensor to control laser power.
The work will include the development of a CAD/CAM data interface, together with machine control and user interfaces.
Pilot demonstrations and evaluation are foreseen through a high-speed in-line application at Thomson.
The results will be applicable to the development of new laser-soldering placement machines, which will be marketed by a vendor consortium vendor.