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Advanced Laser Reflow Soldering for Surface Mount Technology

Objective

The objective of ALERT is to develop the equipment and process required to produce printed circuit boards with surface-mounted devices (SMD) and fine pitch IC (integrated circuit) components with high-speed laser-soldering techniques. Picking, placing and soldering will be combined in one process step.

The approach will be based on:

- vision feedback on placement, to obtain the accuracy necessary for laser soldering ("Look and place")
- beam deflection control based on a new closed-loop sensory control concept, to recognise laser spot position on the board and solder pad positions simultaneously
- a new ultrasound sensor to control laser power.

The work will include the development of a CAD/CAM data interface, together with machine control and user interfaces.

Pilot demonstrations and evaluation are foreseen through a high-speed in-line application at Thomson.

The results will be applicable to the development of new laser-soldering placement machines, which will be marketed by a vendor consortium vendor.

Coordinator

NEDERLANDSE PHILIPS BEDRIJVEN BV
Address
Kastanjelaan, 1218
5600 MD Eindhoven
Netherlands

Participants (4)

DEUTSCHE THOMSON-BRANDT GMBH
Germany
Address
Hermann-schwer-straße 1
78048 Villingen-schwenningen
Friedrich-Alexander-Universität Erlangen Nürnberg
Germany
Address
Martensstraße 3
91058 Erlangen
Siap Sistemi SpA
Italy
Address
Via Mercantesse 3
20021 Milano
Tecnospazio SpA
Italy
Address
Via Montefeltro 8
20156 Milano