Objective The objective of ALERT is to develop the equipment and process required to produce printed circuit boards with surface-mounted devices (SMD) and fine pitch IC (integrated circuit) components with high-speed laser-soldering techniques. Picking, placing and soldering will be combined in one process step.The approach will be based on: - vision feedback on placement, to obtain the accuracy necessary for laser soldering ("Look and place") - beam deflection control based on a new closed-loop sensory control concept, to recognise laser spot position on the board and solder pad positions simultaneously - a new ultrasound sensor to control laser power. The work will include the development of a CAD/CAM data interface, together with machine control and user interfaces. Pilot demonstrations and evaluation are foreseen through a high-speed in-line application at Thomson. The results will be applicable to the development of new laser-soldering placement machines, which will be marketed by a vendor consortium vendor. Fields of science engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsnatural sciencesphysical sciencesopticslaser physicsnatural sciencesphysical sciencesacousticsultrasound Programme(s) FP3-ESPRIT 3 - Specific research and technological development programme (EEC) in the field of information technologies, 1990-1994 Topic(s) Data not available Call for proposal Data not available Funding Scheme Data not available Coordinator NEDERLANDSE PHILIPS BEDRIJVEN BV Address Kastanjelaan, 1218 5600 MD Eindhoven Netherlands See on map EU contribution No data Participants (4) Sort alphabetically Sort by EU Contribution Expand all Collapse all DEUTSCHE THOMSON-BRANDT GMBH Germany EU contribution € 0,00 Address Hermann-schwer-straße 1 78048 Villingen-schwenningen See on map Other funding No data Friedrich-Alexander-Universität Erlangen Nürnberg Germany EU contribution € 0,00 Address Martensstraße 3 91058 Erlangen See on map Other funding No data Siap Sistemi SpA Italy EU contribution € 0,00 Address Via mercantesse 3 20021 Milano See on map Other funding No data Tecnospazio SpA Italy EU contribution € 0,00 Address Via montefeltro 8 20156 Milano See on map Other funding No data
