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ALL-SCALE PREDICTIVE DESIGN OF HEAT MANAGEMENT MATERIAL STRUCTURES WITH APPLICATIONS IN POWER ELECTRONICS

Objective

Heat management is a paramount challenge in many cutting edge technologies, including new GaN electronic technology, turbine thermal coatings, resistive memories, or thermoelectrics. Further progress requires the help of accurate modeling tools that can predict the performance of new complex materials integrated in these increasingly demanding novel devices. However, there is currently no general predictive approach to tackle the complex multiscale modeling of heat flow through such nano and micro-structured systems. The state of the art, our predictive approach “ShengBTE.org”, currently covers the electronic and atomistic scales, going directly from them to predict the macroscopic thermal conductivity of homogeneous bulk materials, but it does not tackle a mesoscopic structure. This project will extend this predictive approach into the mesoscale, enabling it to fully describe thermal transport from the electronic ab initio level, through the atomistic one, all the way into the mesoscopic structure level, within a single model. The project is a 6 partner effort with complementary fields of expertise, 3 academic and 3 from industry. The widened approach will be validated against an extensive range of test case scenarios, including carefully designed experimental measurements taken during the project. The project will deliver a professional multiscale software permitting, for the first time, the prediction of heat flux through complex structured materials of industrial interest. The performance of the modeling tool will be then demonstrated in an industrial setting, to design a new generation of substrates for power electronics based on innovating layered materials. This project is expected to have large impacts in a wide range of industrial applications, particularly in the rapidly evolving field of GaN based power electronics, and in all new technologies where thermal transport is a key issue.

Field of science

  • /natural sciences/physical sciences/electromagnetism and electronics/semiconductor device
  • /engineering and technology/materials engineering/nanocomposites
  • /social sciences/social and economic geography/transport
  • /engineering and technology/nanotechnology/nano-materials

Call for proposal

H2020-NMP-2014-two-stage
See other projects for this call

Funding Scheme

RIA - Research and Innovation action
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Coordinator

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Address
Rue Leblanc 25
75015 Paris 15
France
Activity type
Research Organisations
EU contribution
€ 896 529

Participants (6)

RUHR-UNIVERSITAET BOCHUM

Participation ended

Germany
EU contribution
€ 255 361,25
Address
Universitaetsstrasse 150
44801 Bochum
Activity type
Higher or Secondary Education Establishments
UNIVERSITAT LINZ
Austria
EU contribution
€ 707 000
Address
Altenberger Strasse 69
4040 Linz
Activity type
Higher or Secondary Education Establishments
SILVACO EUROPE LTD
United Kingdom
EU contribution
€ 415 625
Address
Silvaco Technology Centre Compass Point
PE27 5JL St Ives
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
AIXTRON SE
Germany
EU contribution
€ 549 400
Address
Dornkaulstrasse 2
52134 Herzogenrath
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
STMICROELECTRONICS SRL
Italy
EU contribution
€ 47 360
Address
Via C.olivetti 2
20864 Agrate Brianza
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
TECHNISCHE UNIVERSITAET WIEN
Austria
EU contribution
€ 393 388,75
Address
Karlsplatz 13
1040 Wien
Activity type
Higher or Secondary Education Establishments